Patents by Inventor Brice McPherson
Brice McPherson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240105651Abstract: A package for power electronics includes a power substrate, a number of power semiconductor die, and a Kelvin connection contact. Each one of the power semiconductor die are on the power substrate and include a first power switching pad, a second power switching pad, a control pad, a semiconductor structure, and a Kelvin connection pad. The semiconductor structure is between the first power switching pad, the second power switching pad, and the control pad, and is configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad. The Kelvin connection pad is coupled to the power switching path. The Kelvin connection contact is coupled to the Kelvin connection pad of each one of the power semiconductor die via a Kelvin conductive trace on the power substrate.Type: ApplicationFiled: December 6, 2023Publication date: March 28, 2024Inventors: Brice McPherson, Daniel Martin, Jennifer Stabach
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Patent number: 11923344Abstract: A power module is provided with a substrate, power devices, and a housing. The power devices are mounted on device pads of the substrate and arranged to provide a power circuit having a first input, a second input, and at least one output. First and second power terminals provide first and second inputs for the power circuit. At least one output power terminal provides at least one output. The housing encompasses the substrate, the power devices, and portions of the first and second input power terminals as well as the at least one output power terminal. The first and second input power terminals extend out of a first side of the housing, and the at least one output power terminal extends out of a second side of the housing, the first side being opposite the second side.Type: GrantFiled: November 11, 2021Date of Patent: March 5, 2024Assignee: WOLFSPEED, INC.Inventors: Brice McPherson, Shashwat Singh, Roberto M. Schupbach
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Publication number: 20240072131Abstract: Strategic placement and patterning of electrodes, vias, and metal runners can significantly reduce strain in a power semiconductor die. By modifying the path defining electrodes, vias, and metal runners, as well as patterning the material layers thereof, strain can be better managed to increase reliability of a power semiconductor die.Type: ApplicationFiled: November 8, 2023Publication date: February 29, 2024Inventors: Daniel Jenner Lichtenwalner, Edward Robert Van Brunt, Thomas E. Harrington, III, Shadi Sabri, Brett Hull, Brice McPherson, Joe W. McPherson
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Patent number: 11887953Abstract: A package for power electronics includes a power substrate, a number of power semiconductor die, and a Kelvin connection contact. Each one of the power semiconductor die are on the power substrate and include a first power switching pad, a second power switching pad, a control pad, a semiconductor structure, and a Kelvin connection pad. The semiconductor structure is between the first power switching pad, the second power switching pad, and the control pad, and is configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad. The Kelvin connection pad is coupled to the power switching path. The Kelvin connection contact is coupled to the Kelvin connection pad of each one of the power semiconductor die via a Kelvin conductive trace on the power substrate.Type: GrantFiled: June 21, 2021Date of Patent: January 30, 2024Assignee: Wolfspeed, Inc.Inventors: Brice McPherson, Daniel Martin, Jennifer Stabach
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Patent number: 11869948Abstract: Strategic placement and patterning of electrodes, vias, and metal runners can significantly reduce strain in a power semiconductor die. By modifying the path defining electrodes, vias, and metal runners, as well as patterning the material layers thereof, strain can be better managed to increase reliability of a power semiconductor die.Type: GrantFiled: February 17, 2021Date of Patent: January 9, 2024Assignee: Wolfspeed, Inc.Inventors: Daniel Jenner Lichtenwalner, Edward Robert Van Brunt, Thomas E. Harrington, III, Shadi Sabri, Brett Hull, Brice McPherson, Joe W. McPherson
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Publication number: 20230411359Abstract: A power module has a substrate having a top side with a first device pad and a second device pad. A first plurality of vertical power devices is coupled to the first device pad via first drain contacts, and a second plurality of vertical power devices is coupled to the second device pad via second drain contacts to form part of a power circuit. A housing encompasses portions of the substrate, the first plurality of vertical power devices, and the second plurality of vertical power devices. A first power terminal extends through a top surface of the housing to the first device pad. A second power terminal extends through the top surface of the housing to the source contacts on a top side of the second plurality of vertical power devices. A third power terminal extends through a top surface of the housing to the second device pad.Type: ApplicationFiled: June 20, 2022Publication date: December 21, 2023Inventor: Brice McPherson
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Publication number: 20230363097Abstract: A power module is provided with a substrate, power devices, and a housing. The power devices are mounted on device pads of the substrate and arranged to provide a power circuit having a first input, a second input, and at least one output. First and second power terminals provide first and second inputs for the power circuit. At least one output power terminal provides at least one output. The housing encompasses the substrate, the power devices, and portions of the first and second input power terminals as well as the at least one output power terminal.Type: ApplicationFiled: May 4, 2022Publication date: November 9, 2023Inventors: Brice McPherson, Shashwat Singh, Roberto M. Schupbach
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Publication number: 20230335473Abstract: The present disclosure describes a power module having a substrate, first and second pluralities of vertical power devices, and first and second terminal assemblies. The substrate has a top surface with a first trace and a second trace. The first plurality of vertical power devices and the second plurality of vertical power devices are electrically coupled to form part of a power circuit. The first plurality of vertical power devices is electrically and mechanically directly coupled between the first trace and a bottom of a first elongated bar of the first terminal assembly. The second plurality of vertical power devices are electrically and mechanically directly coupled between the second trace and a bottom of a second elongated bar of the second terminal assembly.Type: ApplicationFiled: June 16, 2023Publication date: October 19, 2023Inventors: Brice McPherson, Brandon Passmore, Roberto M. Schupbach, Jennifer Stabach-Smith
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Patent number: 11756910Abstract: A package for power electronics includes a power substrate, a number of power semiconductor die, and a Kelvin connection contact. Each one of the power semiconductor die are on the power substrate and include a first power switching pad, a second power switching pad, a control pad, a semiconductor structure, and a Kelvin connection pad. The semiconductor structure is between the first power switching pad, the second power switching pad, and the control pad, and is configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad. The Kelvin connection pad is coupled to the power switching path. The Kelvin connection contact is coupled to the Kelvin connection pad of each one of the power semiconductor die via a Kelvin conductive trace on the power substrate.Type: GrantFiled: December 21, 2021Date of Patent: September 12, 2023Assignee: WOLFSPEED, INC.Inventors: Brice McPherson, Daniel Martin, Jennifer Stabach
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Patent number: 11735488Abstract: The present disclosure relates to a power module comprising a substrate, first and second pluralities of vertical power devices, and first and second terminal assemblies. The substrate has a top surface with a first trace and a second trace. The first plurality of vertical power devices and a second plurality of vertical power devices are electrically coupled to form part of a power circuit. The first plurality of vertical power devices are electrically and mechanically directly coupled between the first trace and a bottom of a first elongated bar of the first terminal assembly. The second plurality of vertical power devices are electrically and mechanically directly coupled between the second trace and a bottom of a second elongated bar of the second terminal assembly.Type: GrantFiled: July 24, 2020Date of Patent: August 22, 2023Assignee: WOLFSPEED, INC.Inventor: Brice McPherson
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Publication number: 20230260861Abstract: Semiconductor packages and, more particularly, semiconductor packages with increased power handling capabilities are disclosed. Semiconductor packages may include lead frame structures and corresponding housings that incorporate semiconductor die. To promote increased current and voltage capabilities, exemplary semiconductor packages include one or more arrangements of creepage extension structures, lead frame structures that may include integral thermal pads, additional thermal elements, and combinations thereof. Creepage extension structures may be arranged as part of top sides of semiconductor packages along with thermal pads of lead frame structures and additional thermal elements. Creepage extension structures may also be arranged as part of top sides and along on one or more peripheral edges of semiconductor packages to promote further increases in power handling.Type: ApplicationFiled: February 11, 2022Publication date: August 17, 2023Inventors: Geza Dezsi, Devarajan Balaraman, Brice McPherson
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Patent number: 11721617Abstract: The present disclosure describes a power module having a substrate, first and second pluralities of vertical power devices, and first and second terminal assemblies. The substrate has a top surface with a first trace and a second trace. The first plurality of vertical power devices and the second plurality of vertical power devices are electrically coupled to form part of a power circuit. The first plurality of vertical power devices is electrically and mechanically directly coupled between the first trace and a bottom of a first elongated bar of the first terminal assembly. The second plurality of vertical power devices are electrically and mechanically directly coupled between the second trace and a bottom of a second elongated bar of the second terminal assembly.Type: GrantFiled: April 23, 2021Date of Patent: August 8, 2023Assignee: WOLFSPEED, INC.Inventors: Brice McPherson, Brandon Passmore, Roberto M. Schupbach, Jennifer Stabach-Smith
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Patent number: 11696417Abstract: A power module including at least one substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal including a contact surface, a third terminal electrically connected to the at least one power substrate, a plurality of power devices arranged on and connected to the at least one power substrate, and the third terminal being electrically connected to at least one of the plurality of power devices. The power module further including a base plate and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.Type: GrantFiled: July 7, 2022Date of Patent: July 4, 2023Assignee: WOLFSPEED, INC.Inventors: Matthew Feurtado, Brice McPherson, Daniel Martin, Alexander Lostetter
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Publication number: 20230142930Abstract: A power module is provided with a substrate, power devices, and a housing. The power devices are mounted on device pads of the substrate and arranged to provide a power circuit having a first input, a second input, and at least one output. First and second power terminals provide first and second inputs for the power circuit. At least one output power terminal provides at least one output. The housing encompasses the substrate, the power devices, and portions of the first and second input power terminals as well as the at least one output power terminal. The first and second input power terminals extend out of a first side of the housing, and the at least one output power terminal extends out of a second side of the housing, the first side being opposite the second side.Type: ApplicationFiled: November 11, 2021Publication date: May 11, 2023Inventors: Brice McPherson, Shashwat Singh, Roberto M. Schupbach
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Publication number: 20230060641Abstract: Power semiconductor devices, and more particularly arrangements of power semiconductor devices for improved thermal performance in high power applications are disclosed. Arrangements for multiple power semiconductor devices within a package and/or module are provided that more efficiently utilize the active device area of each power semiconductor device for a given operational specification. Certain arrangements are provided that reduce the effects of thermal crowding in order to provide increased power capability or a similar power capability in a reduced device size. Improved thermal balancing may be provided by variable spacing and/or variable offset distances between next-adjacent power semiconductor devices. In this manner, active areas of power devices and/or modules may include an increased density of power semiconductor devices within a given area while also exhibiting improved thermal profiles during operation, thereby providing improved operating characteristics and/or increased operating lifetimes.Type: ApplicationFiled: August 27, 2021Publication date: March 2, 2023Inventors: Brice McPherson, Benjamin A. Samples, Brandon Passmore
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Publication number: 20220354014Abstract: A power module including at least one substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal including a contact surface, a third terminal electrically connected to the at least one power substrate, a plurality of power devices arranged on and connected to the at least one power substrate, and the third terminal being electrically connected to at least one of the plurality of power devices. The power module further including a base plate and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.Type: ApplicationFiled: July 7, 2022Publication date: November 3, 2022Inventors: Matthew FEURTADO, Brice MCPHERSON, Daniel MARTIN, Alexander LOSTETTER
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Patent number: 11445630Abstract: A power module including at least one substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal including a contact surface, a third terminal electrically connected to the at least one power substrate, a plurality of power devices arranged on and connected to the at least one power substrate, and the third terminal being electrically connected to at least one of the plurality of power devices. The power module further including a base plate and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.Type: GrantFiled: January 15, 2021Date of Patent: September 13, 2022Assignee: WOLFSPEED, INC.Inventors: Matthew Feurtado, Brice McPherson, Daniel Martin, Alexander Lostetter
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Publication number: 20220262909Abstract: Strategic placement and patterning of electrodes, vias, and metal runners can significantly reduce strain in a power semiconductor die. By modifying the path defining electrodes, vias, and metal runners, as well as patterning the material layers thereof, strain can be better managed to increase reliability of a power semiconductor die.Type: ApplicationFiled: February 17, 2021Publication date: August 18, 2022Inventors: Daniel Jenner Lichtenwalner, Edward Robert Van Brunt, Thomas E. Harrington, III, Shadi Sabri, Brett Hull, Brice McPherson, Joe W. McPherson
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Patent number: D969740Type: GrantFiled: November 5, 2020Date of Patent: November 15, 2022Assignee: WOLFSPEED, INC.Inventors: Brice McPherson, Alexander Lostetter
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Patent number: D985517Type: GrantFiled: December 29, 2021Date of Patent: May 9, 2023Assignee: WOLFSPEED, INCInventors: Brice McPherson, Matthew Feurtado