Patents by Inventor Brice McPherson

Brice McPherson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12224218
    Abstract: Semiconductor packages and, more particularly, semiconductor packages with increased power handling capabilities are disclosed. Semiconductor packages may include lead frame structures and corresponding housings that incorporate semiconductor die. To promote increased current and voltage capabilities, exemplary semiconductor packages include one or more arrangements of creepage extension structures, lead frame structures that may include integral thermal pads, additional thermal elements, and combinations thereof. Creepage extension structures may be arranged as part of top sides of semiconductor packages along with thermal pads of lead frame structures and additional thermal elements. Creepage extension structures may also be arranged as part of top sides and along on one or more peripheral edges of semiconductor packages to promote further increases in power handling.
    Type: Grant
    Filed: February 11, 2022
    Date of Patent: February 11, 2025
    Assignee: WOLFSPEED, INC.
    Inventors: Geza Dezsi, Devarajan Balaraman, Brice McPherson
  • Patent number: 12199071
    Abstract: A power module is provided with a substrate, power devices, and a housing. The power devices are mounted on device pads of the substrate and arranged to provide a power circuit having a first input, a second input, and at least one output. First and second power terminals provide first and second inputs for the power circuit. At least one output power terminal provides at least one output. The housing encompasses the substrate, the power devices, and portions of the first and second input power terminals as well as the at least one output power terminal. The first and second input power terminals extend out of a first side of the housing, and the at least one output power terminal extends out of a second side of the housing, the first side being opposite the second side.
    Type: Grant
    Filed: February 1, 2024
    Date of Patent: January 14, 2025
    Assignee: WOLFSPEED, INC.
    Inventors: Brice McPherson, Shashwat Singh, Roberto M. Schupbach
  • Publication number: 20250014973
    Abstract: A device includes a power substrate and a first power device on the power substrate. A housing having housing sides having at least a first housing side and a second housing side, the housing configured to house at least the power substrate and the first power device. A plurality of power terminals extending from at least one of the housing sides. The plurality of power terminals having at least a first power terminal and a second power terminal. A plurality of signal terminals extending from at least one of the housing sides. The plurality of signal terminals having at least a source kelvin signal terminal, a gate driver signal terminal, and at least one additional signal terminal.
    Type: Application
    Filed: July 3, 2023
    Publication date: January 9, 2025
    Inventors: Paul WHEELER, Brice MCPHERSON, Roberto Marcelo SCHUPBACH, Leonardo MONTOYA, Brandon PASSMORE, Mohammad Hazzaz MAHMUD, Ben SAMPLES, Prasana Obala BHUVANESH, Ajit R. KANALE
  • Patent number: 12159909
    Abstract: Strategic placement and patterning of electrodes, vias, and metal runners can significantly reduce strain in a power semiconductor die. By modifying the path defining electrodes, vias, and metal runners, as well as patterning the material layers thereof, strain can be better managed to increase reliability of a power semiconductor die.
    Type: Grant
    Filed: November 8, 2023
    Date of Patent: December 3, 2024
    Assignee: Wolfspeed, Inc.
    Inventors: Daniel Jenner Lichtenwalner, Edward Robert Van Brunt, Thomas E. Harrington, III, Shadi Sabri, Brett Hull, Brice McPherson, Joe W. McPherson
  • Publication number: 20240395677
    Abstract: The present disclosure describes a power module having a substrate, first and second pluralities of vertical power devices, and first and second terminal assemblies. The substrate has a top surface with a first trace and a second trace. The first plurality of vertical power devices and the second plurality of vertical power devices are electrically coupled to form part of a power circuit. The first plurality of vertical power devices is electrically and mechanically directly coupled between the first trace and a bottom of a first elongated bar of the first terminal assembly. The second plurality of vertical power devices are electrically and mechanically directly coupled between the second trace and a bottom of a second elongated bar of the second terminal assembly.
    Type: Application
    Filed: August 2, 2024
    Publication date: November 28, 2024
    Inventors: Brice McPherson, Brandon Passmore, Roberto M. Schupbach, Jennifer Stabach-Smith
  • Patent number: 12150258
    Abstract: A power module is provided with a substrate, power devices, and a housing. The power devices are mounted on device pads of the substrate and arranged to provide a power circuit having a first input, a second input, and at least one output. First and second power terminals provide first and second inputs for the power circuit. At least one output power terminal provides at least one output. The housing encompasses the substrate, the power devices, and portions of the first and second input power terminals as well as the at least one output power terminal.
    Type: Grant
    Filed: May 4, 2022
    Date of Patent: November 19, 2024
    Assignee: WOLFSPEED, INC.
    Inventors: Brice McPherson, Shashwat Singh, Roberto M. Schupbach
  • Patent number: 12080635
    Abstract: The present disclosure describes a power module having a substrate, first and second pluralities of vertical power devices, and first and second terminal assemblies. The substrate has a top surface with a first trace and a second trace. The first plurality of vertical power devices and the second plurality of vertical power devices are electrically coupled to form part of a power circuit. The first plurality of vertical power devices is electrically and mechanically directly coupled between the first trace and a bottom of a first elongated bar of the first terminal assembly. The second plurality of vertical power devices are electrically and mechanically directly coupled between the second trace and a bottom of a second elongated bar of the second terminal assembly.
    Type: Grant
    Filed: June 16, 2023
    Date of Patent: September 3, 2024
    Assignee: WOLFSPEED, INC.
    Inventors: Brice McPherson, Brandon Passmore, Roberto M. Schupbach, Jennifer Stabach-Smith
  • Publication number: 20240292575
    Abstract: The disclosure is directed to a power module that includes at least one power substrate, a housing arranged on the at least one power substrate, and a first terminal electrically connected to the at least one power substrate. The first terminal includes a contact surface located above the housing at a first elevation. The power module includes a second terminal including a contact surface located above the housing at a second elevation different from the first elevation, a third terminal electrically connected to the at least one power substrate, and a plurality of power devices electrically connected to the at least one power substrate.
    Type: Application
    Filed: May 6, 2024
    Publication date: August 29, 2024
    Inventors: Daniel Martin, Brice McPherson, Alexander Lostetter
  • Publication number: 20240274660
    Abstract: Semiconductor devices comprises a semiconductor die that comprises a substrate that has a hexagonal crystal structure. First and second sides of the semiconductor die extend along respective first and second crystallographic axes of the hexagonal crystal structure of the substrate.
    Type: Application
    Filed: February 9, 2023
    Publication date: August 15, 2024
    Inventors: Edward Robert Van Brunt, Brice McPherson, Josh S. Pennington
  • Publication number: 20240274584
    Abstract: A power module is provided with a substrate, power devices, and a housing. The power devices are mounted on device pads of the substrate and arranged to provide a power circuit having a first input, a second input, and at least one output. First and second power terminals provide first and second inputs for the power circuit. At least one output power terminal provides at least one output. The housing encompasses the substrate, the power devices, and portions of the first and second input power terminals as well as the at least one output power terminal. The first and second input power terminals extend out of a first side of the housing, and the at least one output power terminal extends out of a second side of the housing, the first side being opposite the second side.
    Type: Application
    Filed: February 1, 2024
    Publication date: August 15, 2024
    Inventors: Brice McPherson, Shashwat Singh, Roberto M. Schupbach
  • Publication number: 20240213196
    Abstract: Power semiconductor devices are provided. In one example, a semiconductor device includes a semiconductor vertical power device structure. The semiconductor device includes a first metallization layer on the semiconductor structure. The first metallization layer includes one or more metal structures. The semiconductor device includes a second metallization layer at least partially overlapping the first metallization layer. The semiconductor device includes an insulating layer between the first metallization layer and the second metallization layer. The insulating layer includes an insulating portion. The insulating portion may be patterned to insulate the one or more metal structures of the first metallization layer.
    Type: Application
    Filed: January 27, 2023
    Publication date: June 27, 2024
    Inventors: Thomas Edgar Harrington, III, Brice McPherson, Scott Allen
  • Publication number: 20240213124
    Abstract: A power package includes a power substrate; one or more power devices arranged on the power substrate; and a lead frame power interconnection having a lead frame first portion and a lead frame second portion.
    Type: Application
    Filed: December 22, 2022
    Publication date: June 27, 2024
    Inventors: Brice MCPHERSON, Shashwat SINGH, Brandon PASSMORE, Roberto Marcelo SCHUPBACH, Mohammed Hazzaz MAHMUD
  • Patent number: 12010823
    Abstract: The disclosure is directed to a power module that includes at least one power substrate, a housing arranged on the at least one power substrate, and a first terminal electrically connected to the at least one power substrate. The first terminal includes a contact surface located above the housing at a first elevation. The power module includes a second terminal including a contact surface located above the housing at a second elevation different from the first elevation, a third terminal electrically connected to the at least one power substrate, and a plurality of power devices electrically connected to the at least one power substrate.
    Type: Grant
    Filed: June 2, 2020
    Date of Patent: June 11, 2024
    Assignee: Wolfspeed, Inc.
    Inventors: Daniel Martin, Brice McPherson, Alexander Lostetter
  • Patent number: 11984433
    Abstract: Power semiconductor devices, and more particularly arrangements of power semiconductor devices for improved thermal performance in high power applications are disclosed. Arrangements for multiple power semiconductor devices within a package and/or module are provided that more efficiently utilize the active device area of each power semiconductor device for a given operational specification. Certain arrangements are provided that reduce the effects of thermal crowding in order to provide increased power capability or a similar power capability in a reduced device size. Improved thermal balancing may be provided by variable spacing and/or variable offset distances between next-adjacent power semiconductor devices. In this manner, active areas of power devices and/or modules may include an increased density of power semiconductor devices within a given area while also exhibiting improved thermal profiles during operation, thereby providing improved operating characteristics and/or increased operating lifetimes.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: May 14, 2024
    Assignee: Wolfspeed, Inc.
    Inventors: Brice McPherson, Benjamin A. Samples, Brandon Passmore
  • Publication number: 20240105651
    Abstract: A package for power electronics includes a power substrate, a number of power semiconductor die, and a Kelvin connection contact. Each one of the power semiconductor die are on the power substrate and include a first power switching pad, a second power switching pad, a control pad, a semiconductor structure, and a Kelvin connection pad. The semiconductor structure is between the first power switching pad, the second power switching pad, and the control pad, and is configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad. The Kelvin connection pad is coupled to the power switching path. The Kelvin connection contact is coupled to the Kelvin connection pad of each one of the power semiconductor die via a Kelvin conductive trace on the power substrate.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Inventors: Brice McPherson, Daniel Martin, Jennifer Stabach
  • Patent number: 11923344
    Abstract: A power module is provided with a substrate, power devices, and a housing. The power devices are mounted on device pads of the substrate and arranged to provide a power circuit having a first input, a second input, and at least one output. First and second power terminals provide first and second inputs for the power circuit. At least one output power terminal provides at least one output. The housing encompasses the substrate, the power devices, and portions of the first and second input power terminals as well as the at least one output power terminal. The first and second input power terminals extend out of a first side of the housing, and the at least one output power terminal extends out of a second side of the housing, the first side being opposite the second side.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: March 5, 2024
    Assignee: WOLFSPEED, INC.
    Inventors: Brice McPherson, Shashwat Singh, Roberto M. Schupbach
  • Publication number: 20240072131
    Abstract: Strategic placement and patterning of electrodes, vias, and metal runners can significantly reduce strain in a power semiconductor die. By modifying the path defining electrodes, vias, and metal runners, as well as patterning the material layers thereof, strain can be better managed to increase reliability of a power semiconductor die.
    Type: Application
    Filed: November 8, 2023
    Publication date: February 29, 2024
    Inventors: Daniel Jenner Lichtenwalner, Edward Robert Van Brunt, Thomas E. Harrington, III, Shadi Sabri, Brett Hull, Brice McPherson, Joe W. McPherson
  • Patent number: D1036395
    Type: Grant
    Filed: September 30, 2022
    Date of Patent: July 23, 2024
    Assignee: Wolfspeed, Inc.
    Inventors: Brice McPherson, Alexander Lostetter
  • Patent number: D1041429
    Type: Grant
    Filed: March 29, 2023
    Date of Patent: September 10, 2024
    Assignee: Wolfspeed, Inc.
    Inventors: Brice McPherson, Matthew Feurtado
  • Patent number: D1056862
    Type: Grant
    Filed: August 24, 2022
    Date of Patent: January 7, 2025
    Assignee: Wolfspeed, Inc.
    Inventors: Geza Dezsi, Devarajan Balaraman, Brice McPherson