Patents by Inventor Bridger E. Hoerner

Bridger E. Hoerner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroplating tool with feedback of metal thickness distribution and correction
    Patent number: 10260855
    Abstract: An electroplating reactor includes an electro-plating solution in a bath, a ring cathode in the bath and located to contact a workpiece such that only the front side of the workpiece is immersed in the solution, plural anodes immersed in the bath below the ring cathode, and plural anode voltage sources coupled to the plural anodes; plural thickness sensors at spatially separate locations on the back side of the workpiece with feedback control to the anode voltage sources.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: April 16, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Todd J. Egan, Edward W. Budiarto, Robert O. Miller, Abraham Ravid, Bridger E. Hoerner, Robert W. Batz, Jr., Daniel J. Woodruff
  • ELECTROPLATING TOOL WITH FEEDBACK OF METAL THICKNESS DISTRIBUTION AND CORRECTION
    Publication number: 20140367267
    Abstract: An electroplating reactor includes an electro-plating solution in a bath, a ring cathode in the bath and located to contact a workpiece such that only the front side of the workpiece is immersed in the solution, plural anodes immersed in the bath below the ring cathode, and plural anode voltage sources coupled to the plural anodes; plural thickness sensors at spatially separate locations on the back side of the workpiece with feedback control to the anode voltage sources.
    Type: Application
    Filed: October 29, 2013
    Publication date: December 18, 2014
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Todd J. Egan, Edward W. Budiarto, Robert O. Miller, Abraham Ravid, Bridger E. Hoerner, Robert W. Batz, JR., Daniel J. Woodruff