Patents by Inventor Bridger Hoerner

Bridger Hoerner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for wetting substrates
    Patent number: 10373864
    Abstract: Methods of wetting a semiconductor substrate may include forming a controlled atmosphere in a processing chamber housing the semiconductor substrate. The semiconductor substrate may define a plurality of features, which may include vias. The methods may include flowing a wetting agent into the processing chamber. A chamber pressure may be maintained below about 100 kPa. The methods may also include wetting the plurality of features defined in the substrate.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: August 6, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Paul McHugh, Bridger Hoerner, Marvin Bernt, Thomas H. Oberlitner, Brian Aegerter, Richard W. Plavidal, Andrew Anten, Adam McClure, Randy Harris
  • SYSTEMS AND METHODS FOR WETTING SUBSTRATES
    Publication number: 20180182664
    Abstract: Methods of wetting a semiconductor substrate may include forming a controlled atmosphere in a processing chamber housing the semiconductor substrate. The semiconductor substrate may define a plurality of features, which may include vias. The methods may include flowing a wetting agent into the processing chamber. A chamber pressure may be maintained below about 100 kPa. The methods may also include wetting the plurality of features defined in the substrate.
    Type: Application
    Filed: December 22, 2017
    Publication date: June 28, 2018
    Applicant: Applied Materials, Inc.
    Inventors: Paul McHugh, Bridger Hoerner, Marvin Bernt, Thomas H. Oberlitner, Brian Aegerter, Richard W. Plavidal, Andrew Anten, Adam McClure, Randy Harris
  • ELECTROPLATING WITH REDUCED AIR BUBBLE DEFECTS
    Publication number: 20160237584
    Abstract: A method for processing a wafer includes holding the wafer in a face-up position with a seal ring contacting the wafer on a contact circumference. A bead of liquid is applied onto the entire contact circumference, with the bead of liquid contacting the wafer and the seal ring. The wafer is then inverted into a head-down position, lowered into contact with electrolyte and plated with a conductive film. Formation of the bead of liquid helps to displace air bubbles as the wafer is immersed into the electrolyte which reduces plating defects.
    Type: Application
    Filed: February 12, 2015
    Publication date: August 18, 2016
    Inventors: Paul R. McHugh, Gregory J. Wilson, John L. Klocke, Randy A. Harris, Bridger Hoerner, Paul Van Valkenburg