Abstract: A scattered-light smoke detector includes a detector unit that operates according to the scattered-light principle. The detector unit includes a light-emitting diode (LED) to irradiate particles to be detected and a spectrally sensitive photosensor to detect the light scattered by the particles. The LED and photosensor are aligned such that a principal optical axis of the LED and a principal optical axis of the photosensor define a scattered-light angle. The LED includes a first and a second LED chip for emitting first and second light beams with light in a first wavelength range and a different second wavelength range, and an LED chip carrier arranged orthogonally to the principal optical axis. The two LED chips are arranged side-by-side on the LED chip carrier. The LED is rotated such that a chip axis extending through the two LED chips is orthogonal to an angle plane defined by the two optical axes.

Abstract: A scattered-light smoke detector includes a detector unit that operates according to the scattered-light principle. The detector unit includes a light-emitting diode (LED) to irradiate particles to be detected and a spectrally sensitive photosensor to detect the light scattered by the particles. The LED and photosensor are aligned such that a principal optical axis of the LED and a principal optical axis of the photosensor define a scattered-light angle. The LED includes a first and a second LED chip for emitting first and second light beams with light in a first wavelength range and a different second wavelength range, and an LED chip carrier arranged orthogonally to the principal optical axis. The two LED chips are arranged side-by-side on the LED chip carrier. The LED is rotated such that a chip axis extending through the two LED chips is orthogonal to an angle plane defined by the two optical axes.

Abstract: The object protection device (M) has an imaging sensor (1) for generating images of an object to be protected and its environment and evaluation electronics (2) for evaluating these images. The evaluation electronics (2) are provided in situ or on the sensor (1) and together with it form an autonomous device (M). Evaluation of the images takes place locally, and in normal cases there is no transfer of the images to a central unit (6). The imaging sensor (1) is formed by a CMOS camera and the evaluation electronics (2) are integrated therein or connected thereto.

Abstract: In a process for the irradiation of strand-shaped irradiated material (19; 19a-e), in particular cable insulation or sheathing (31) capable of being cross-linked by irradiation, or tubes, hoses, or profile elements capable of being cross-linked by irradiation, with electron beams impinging transversely to the longitudinal axis of the irradiated material (19; 19a-e), which strike the irradiated material (19; 19a-e) from two fixed irradiation directions (R1, R2), located at an angle to one another which is other than zero and for preference is a right angle, a uniform irradiation is achieved in a simple manner in that a scanned electron beam (17) is created from an electron beam (11) in a scanner (12) by means of a scan device (13), which by means of a temporally-actuated back-and-forth slewing movement in a prescribed angle range creates a radiation fan transversely to the longitudinal direction of the irradiated material, and that the scanned electron beam (17) is deflected by a deflection magnet (16, 16&prim