Abstract: A method of preparation of a first surface of an electronic component, the first surface being intended to be bonded to another electronic component by a direct bonding and the first surface having previously been submitted to a surface treatment in an atmosphere including nitrogen, for example, a treatment in a nitrogen plasma or an ozone UV treatment, the preparation method including: placing into contact the first surface with an aqueous solution including at least 90% water, for a contacting duration longer than or equal to 30 minutes; and then drying the first surface.

Abstract: A process for bonding chips to a substrate by direct bonding includes providing a support with which the chips are in contact, the chips in contact with the support being separate from one another. This bonding process also includes forming a liquid film on one face of the substrate, bringing the chips into contact with the liquid film, where the action of bringing the chips into contact with the liquid film causes attraction of the chips toward the substrate, and evaporating the liquid film in order to bond the chips to the substrate by direct bonding.

Abstract: A system is provided for individually supporting at least one component having opposing front and back faces, including a supporting device having a plurality of cells each delimited by a wall and having a contact zone to support the component, at least a part of the cells each receiving a component by its front face, the supporting and contact zones are configured so a surface of the front face is not in contact with the wall, the contact zone is located on a periphery of the front face and forms a closed zone around the front face, the supporting zone forms a closed zone on the wall, and the contact zone includes an edge surface set back in a thickness direction with respect to the front face, the thickness direction extending from the front to the back face perpendicular to at least one of the faces.

Abstract: The invention relates to a system for individually supporting components (20), comprising at least one component (20) each comprising a front face (21) and a back face (22) opposite the front face (21), and a supporting device comprising a member (40) supporting said components (20), characterized in that the supporting member (40) is provided with cells (2) each one being delimited by a wall, with at least a part of the cells (41) each receiving a component (20) by the front face (21) thereof, with the cells (41) including a zone supporting a contact zone of the component (20), with the supporting zone and the contact zone being so configured that the surface of the front face (21) of the component (20) is not in contact with the wall of the cell (41).

Abstract: A method for manufacturing a triode type cathode structure including depositing and etching: a cathode layer as cathode conductors; a grid layer as grid conductors; an electrical insulation layer and the grid conductors until reaching a resistive layer to provide cavities; and the cathode conductors to have a perforated structure at the intersection of the cathode conductors and grid conductors.

Abstract: This invention relates to a triode type cathode structure comprising, in superposition, an electrode forming a cathode (13) and supporting means made of an electron emitting material in the form of a layer (14), an electrical insulation layer (11) and a grid electrode (15), an opening (12) formed in the grid electrode and in the electrical insulation layer exposing the means made of an electron emitting material. The means made of an electron emitting material (14) are located in the central part of the opening of the grid electrode (15), this opening being in the form of a slit and the means made of an electron emitting material exposed by the slit being composed of elements aligned along the longitudinal axis of the slit.

Abstract: A method for manufacturing a triode type cathode structure including depositing and etching: a cathode layer as cathode conductors; a grid layer as grid conductors; an electrical insulation layer and the grid conductors until reaching a resistive layer to provide cavities; and the cathode conductors to have a perforated structure at the intersection of the cathode conductors and grid conductors.

Abstract: A triode type cathode structure including a cathode assembly composed of a cathode electrode at least one electron emitter and a resistive layer inserted between the cathode electrode and the at least one electron emitter to connect them together electrically. The triode cathode structure also includes a grid electrode separated from the cathode assembly by a layer of electrical insulation. The cathode electrode is arranged in a first plane and the at least one electron emitter is arranged in a second plane parallel to the first plane and the cathode electrode and each electron emitter are separated by a same distance measured in a third plane parallel to the first and second planes.

Abstract: This invention relates to a triode type cathode structure comprising, in superposition, an electrode forming a cathode (13) and supporting means made of an electron emitting material in the form of a layer (14), an electrical insulation layer (11) and a grid electrode (15), an opening (12) formed in the grid electrode and in the electrical insulation layer exposing the means made of an electron emitting material. The means made of an electron emitting material (14) are located in the central part of the opening of the grid electrode (15), this opening being in the form of a slit and the means made of an electron emitting material exposed by the slit being composed of elements aligned along the longitudinal axis of the slit.

Abstract: A device produces an electric field between two electrodes, the electric field having a specified value in the vicinity of a first of the two electrodes. The device includes a means for applying a potential difference between the two electrodes, means forming modulation electrode located near to the first electrode in the vicinity of which the electric field must have specified value. The device also includes control means for applying a potential difference between the means forming modulation electrode and the first electrode located nearby in order to obtain, through the contribution of the potential differences, the specified value of electric field.

Abstract: The invention relates to a triode type cathode structure comprising a cathode assembly composed of a cathode electrode (33), a layer of electron emitting material (34) and a resistive layer (36) inserted between the cathode electrode (33) and the layer of electron emitting material (34) to connect them together electrically, the structure also comprising a grid electrode (35) separated from the said cathode assembly by a layer of electrical insulation (31). The cathode electrode (33) and the layer of electron emitting material (34) are arranged one at the side of the other.

Abstract: A microtip electron source including at least one electron emission zone composed of a plurality of microtips connected electrically to a cathode conductor. At least one gate electrode is positioned opposite the electron emission zone and pierced with apertures located opposite the microtips, to extract the electrons from the microtips. An emitted electron focusing gate is positioned opposite the gate electrode, and includes an aperture unit including at least one slit located opposite at least two successive microtips. A flat display screen can include such a microtip electron source. Further, a manufacturing process of such an electron source is disclosed.

Abstract: The invention involves the making of a group of apertures spaced in a precise manner on a structure and including, for example, a first aperture made in a first layer and a second aperture made in a second layer which covers the first layer, the first aperture being located within the second aperture.

Abstract: A process for manufacturing a micropoint electron source with an extraction grid and a focusing grid. This process allows for precise alignment of the holes of the extraction grid with the apertures of the focusing grid by using a single photolithography step for making the holes in the extraction grid. Such a process may find particular application for making a micropoint electron source for a flat viewing screen.

Abstract: A display screen which includes a microtip electron source which is observerable through the microtip support. The screen includes a cathodoluminescent anode, transparent support and cathode conductors formed on the support. The conductors are meshed according to a first pattern which includes openings. A resistive layer formed on the support is meshed according to a second pattern and includes solid areas located in the openings of the first pattern. Microtips are formed on the solid areas. Grids are meshed according to the second pattern in an unmeshed insulating layer which is transparent and extends above the cathode conductors and the resistive layer in between them and the grids.

Abstract: Self-alignment process usable in microelectronics to obtain alignment of at least one group of holes, one of said holes (or large diameter hole) being formed in an upper level and the other hole (or small diameter hole) being formed in a lower level of a stacked structure.

Abstract: A method and a device for the formation of holes in a layer of photosensitive material, in particular for the manufacture of electron sources.This method is characterized in that a membrane (121) with micro-perforations (122) is laid onto the layer of photosensitive material (120); the layer of photosensitive material is insolated through the membrane (121) in order to print areas (125) corresponding to the micro-perforations (122); the membrane (121) is separated from the layer of photosensitive material (120) thus insolated and the photosensitive layer (120) is then developed in order to form holes in it corresponding to the insolated areas (125).

Abstract: An electron collector having an anode constituted by a substrate (21, 40, 41) on which are deposited conductive strips or tracks (23, 43). A dielectric material layer is deposited on at least one of the edges of each conductive strip.

Abstract: A cathodoluminescent anode is formed on an insulating substrate, while on another insulating substrate are formed cathode conductors, an insulating layer, a grid layer used for the formation of grids, holes in the insulating layer and the grid layer and microtips in the holes. Moreover, a thin insulating layer is formed on the grid layer in order to limit the current liable to flow between the anode and the grids. Another thin layer or film is formed on the thin insulating layer that is sufficiently conductive or resistive to prevent disturbance by the thin electrically insulating layer, of the electric field created between the microtips and the grids.

Abstract: A process for the formation of holes in a photosensitive resin layer, which can be applied to the production of electron sources having emissive cathodes with microtips and flat display screens. According to this process, a resin layer is exposed through a monolayer of balls transparent to an exposure light, with each ball focussing the light onto the resin layer and in this way bringing about the exposure of an area of said resin layer so that the thus exposed resin layer is developed.