Abstract: A method for modifying the surface energy of at least one surface of a solid is provided. The method may comprise a step consisting of grafting, on the surface, a polymeric organic film consisting of graft polymers, each polymer having a first unit bound directly to the surface derived from a cleavable aryl salt and at least one other unit of the polymer chain derived from a component selected from the group consisting of a cleavable fluorinated aryl salt, a fluorinated (meth)acrylate and a vinyl-terminated siloxane. In addition, a kit for implementation of the method is provided.

Abstract: The invention relates to a process for forming a polymeric organic film on an electrically conductive or semiconductive surface by application of an electric potential between a gel, in contact with said surface, and said surface, the gel comprising (i) a protic solvent, (ii) compounds having colloidal properties, (iii) an adhesion primer, optionally (iv) a monomer and the potential applied being at least equal to the reduction potential of the adhesion primer. The invention also relates to said gel, to its use and to a kit for forming an organic film.

Abstract: A method for modifying the surface energy of at least one surface of a solid is provided. The method may comprise a step consisting of grafting, on the surface, a polymeric organic film consisting of graft polymers, each polymer having a first unit bound directly to the surface derived from a cleavable aryl salt and at least one other unit of the polymer chain derived from a component selected from the group consisting of a cleavable fluorinated aryl salt, a fluorinated (meth)acrylate and a vinyl-terminated siloxane. In addition, a kit for implementation of the method is provided.

Abstract: The present invention provides a method for encapsulating biocompatible polymers. The method comprises using a solid support comprising at least one electrically conducting and/or semiconducting region containing a reducible oxide on its surface, wherein at least one zone of this surface is functionalized with an electrografted organic film obtained from electroactive organic precursors each comprising at least one functional group of interest, and wherein the number of functional groups of interest accessible for the formation of a covalent, ionic or hydrogen bond with a complementary group within said film represents at least 90% of the total number of functional organic groups of interest, and wherein the density of the accessible functional groups of interest is between 104/?m2 and 1010/?m2. The method further comprises attaching molecules of interest or objects bearing a complementary function to the solid support.

Abstract: The invention relates to a process for forming a polymeric organic film on an electrically conductive or semiconductive surface by application of an electric potential between a gel, in contact with said surface, and said surface, the gel comprising (i) a protic solvent, (ii) compounds having colloidal properties, (iii) an adhesion primer, optionally (iv) a monomer and the potential applied being at least equal to the reduction potential of the adhesion primer. The invention also relates to said gel, to its use and to a kit for forming an organic film.

Abstract: The invention concerns a solid support comprising a functionalized electricity conductor or semiconductor surface coated with a functionalized electrografted organic layer wherein at least 90% of the number of functional groups of interest is accessible. The invention also concerns the method for preparing such a support and uses thereof, in particular as adhesive primer for fixing molecules of interest or objects bearing a complementary function (molecular adhesive).

Abstract: A method of forming a network of islands (124) of semiconductor material on an electrically insulating material (112), comprising: p1 a) the deposition of nucleation kernels (122) on the surface of the electrically insulating material, b) the formation of islands of semiconductor material (124) respectively on the nucleation kernels. In accordance with the invention, the deposition of the nucleation kernels is effected using at least one so-called distribution layer (116) made of a material having a substantially regular molecular structure, formed on the surface of the electrically insulating material (112), in order to distribute the nucleation kernels in a substantially regular fashion on the surface of the electrically insulating material.