Patents by Inventor Britton Lee Kaliszewski

Britton Lee Kaliszewski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards
    Patent number: 6670101
    Abstract: The invention is a process for building-up printed wiring boards using metal foil coated with toughened benzocyclobutene-based dielectric polymers. The invention is also a toughened dielectric polymer comprising benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additive, and, optionally, a photoactive compound.
    Type: Grant
    Filed: January 10, 2002
    Date of Patent: December 30, 2003
    Assignee: Dow Global Technologies Inc.
    Inventors: Kaoru Ohba, Hideki Akimoto, Philip E. Garrou, Ying-Hung So, Britton Lee Kaliszewski
  • Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards
    Publication number: 20020102495
    Abstract: The invention is a process for building-up printed wiring boards using metal foil coated with toughened benzocyclobutene-based dielectric polymers. The invention is also a toughened dielectric polymer comprising benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additive, and, optionally, a photoactive compound.
    Type: Application
    Filed: January 10, 2002
    Publication date: August 1, 2002
    Inventors: Kaoru Ohba, Hideki Akimoto, Brian Martin, Albert Charles Marie Achen, Philip E. Garrou, Ying-Hung So, Britton Lee Kaliszewski
  • Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards
    Publication number: 20020102494
    Abstract: The invention is a process for building-up printed wiring boards using metal foil coated with toughened benzocyclobutene-based dielectric polymers. The invention is also a toughened dielectric polymer comprising benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additive, and, optionally, a photoactive compound.
    Type: Application
    Filed: January 10, 2002
    Publication date: August 1, 2002
    Inventors: Kaoru Ohba, Hideki Akimoto, Brian Martin, Albert Charles Marie Achen, Philip E. Garrou, Ying-Hung So, Britton Lee Kaliszewski
  • Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards
    Patent number: 6420093
    Abstract: The invention is a process for building-up printed wiring boards using metal foil coated with toughened benzocyclobutene-based dielectric polymers. The invention is also a toughened dielectric polymer comprising benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additive, and, optionally, a photoactive compound.
    Type: Grant
    Filed: February 2, 2000
    Date of Patent: July 16, 2002
    Assignee: The Dow Chemical Company
    Inventors: Kaoru Ohba, Brian Martin, Hideki Akimoto, Albert Charles Marie Achen, Philip E. Garrou, Britton Lee Kaliszewski, Ying-Hung So