Abstract: A method for electronically connecting a semiconductor device comprising a substrate having a backside surface and a top surface on which is formed active elements, to an electronic circuit board having at least two electrical contacts connected to sources of different potentials for communicating at least two different signals; the method comprising forming at least two through-wafer via holes on the backside surface of the semiconductor substrate beneath each of the active regions extending therethrough to the top surface; forming a conductive layer of material within each of the via holes extending therethrough, each of the conductive layers formed within the corresponding via holes being electrically separated from one another; the at least two electrical contacts on the circuit board congruently aligned with corresponding conductive layers and associated via holes; and attaching the circuit board to the semiconductor substrate at each of the corresponding electrical contacts and conductive layers so as t