Patents by Inventor Brook Ferney

Brook Ferney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer polishing control
    Publication number: 20070155284
    Abstract: Methods of controlling polishing of wafers are disclosed. In one aspect, a method may include measuring one or more pre-polish thicknesses of one or more layers of a wafer. The one or more layers may then be polished. Then a post-polish thickness of a layer of the wafer may be measured. Polishing may be controlled by using feed-forward control with the one or more pre-polish thicknesses and by using feed-back control with the post-polish thickness. Machine-accessible software to perform such methods are also disclosed as are systems in which such methods may be implemented.
    Type: Application
    Filed: December 30, 2005
    Publication date: July 5, 2007
    Inventors: Matthew Ring, Scot Goerutiz, Kimberly Ryglelski, Anju Narendra, Kevin Heldrich, Brook Ferney