Patents by Inventor Brook Raymond
Brook Raymond has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240105698Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.Type: ApplicationFiled: December 7, 2023Publication date: March 28, 2024Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
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Patent number: 11881475Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.Type: GrantFiled: June 22, 2022Date of Patent: January 23, 2024Assignee: X Display Company Technology LimitedInventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
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Publication number: 20230343630Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.Type: ApplicationFiled: April 27, 2023Publication date: October 26, 2023Inventors: Christopher Andrew Bower, Matthew Meitl, Salvatore Bonafede, Brook Raymond, Carl Ray Prevatte, Jr.
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Patent number: 11705439Abstract: A multi-color LED display comprises pixels, each comprising a first sub-pixel, a second sub-pixel, and a third sub-pixel. The first sub-pixel comprises a first light-emitting diode (LED) that emits a first color of light, the second sub-pixel comprises second LEDs that emit a second color of light different from the first color of light, and the third sub-pixel comprises third LEDs that emit a third color of light different from the first color of light and different from the second color of light. The second LEDs are electrically connected in parallel and the third LEDs are electrically connected in series.Type: GrantFiled: January 25, 2021Date of Patent: July 18, 2023Assignee: X Display Company Technology LimitedInventors: Matthew Alexander Meitl, Christopher Andrew Bower, Ronald S. Cok, Brook Raymond
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Patent number: 11670533Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.Type: GrantFiled: July 6, 2020Date of Patent: June 6, 2023Assignee: X Display Company Technology LimitedInventors: Christopher Andrew Bower, Matthew Meitl, Salvatore Bonafede, Brook Raymond, Carl Ray Prevatte, Jr.
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Publication number: 20230091571Abstract: An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.Type: ApplicationFiled: November 14, 2022Publication date: March 23, 2023Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Brook Raymond, Salvatore Bonafede
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Patent number: 11600744Abstract: A transfer-printable (e.g., micro-transfer-printable) device source wafer comprises a growth substrate comprising a growth material, a plurality of device structures comprising one or more device materials different from the growth material, the device structures disposed on and laterally spaced apart over the growth substrate, each device structure comprising a device, and a patterned dissociation interface disposed between each device structure of the plurality of device structures and the growth substrate. The growth material is more transparent to a desired frequency of electromagnetic radiation than at least one of the one or more device materials. The patterned dissociation interface has one or more areas of relatively greater adhesion each defining an anchor between the growth substrate and a device structure of the plurality of device structures and one or more dissociated areas of relatively lesser adhesion between the growth substrate and the device structure of the plurality of device structures.Type: GrantFiled: November 19, 2021Date of Patent: March 7, 2023Assignee: X Display Company Technology LimitedInventors: Brook Raymond, Christopher Andrew Bower, Matthew Meitl, Ronald S. Cok
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Patent number: 11540398Abstract: An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.Type: GrantFiled: March 28, 2022Date of Patent: December 27, 2022Assignee: X Display Company Technology LimitedInventors: Christopher Andrew Bower, Matthew Alexander Meitl, Brook Raymond, Salvatore Bonafede
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Patent number: 11527691Abstract: A printed structure includes a destination substrate comprising two or more contact pads disposed on or in a surface of the destination substrate, a component disposed on the surface, and two or more electrically conductive connection posts. Each of the connection posts extends from a common side of the component. Each of the connection posts is in electrical and physical contact with one of the contact pads. The component is tilted with respect to the surface of the destination substrate. Each of the connection posts has a flat distal surface.Type: GrantFiled: July 9, 2021Date of Patent: December 13, 2022Assignee: X Display Company Technology LimitedInventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson
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Publication number: 20220368306Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.Type: ApplicationFiled: May 11, 2021Publication date: November 17, 2022Inventors: Matthew Alexander Meitl, Christopher Andrew Bower, Salvatore Bonafede, Carl Ray Prevatte, JR., Ronald S. Cok, Brook Raymond
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Patent number: 11488943Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.Type: GrantFiled: September 23, 2020Date of Patent: November 1, 2022Assignee: X Display Company Technology LimitedInventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
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Patent number: 11483937Abstract: An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.Type: GrantFiled: December 20, 2019Date of Patent: October 25, 2022Assignee: X Display Company Technology LimitedInventors: Christopher Andrew Bower, Matthew Alexander Meitl, Brook Raymond, Salvatore Bonafede
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Publication number: 20220320061Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.Type: ApplicationFiled: June 22, 2022Publication date: October 6, 2022Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Andrew Tyler Pearson, Erik Paul Vick
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Patent number: 11430774Abstract: A bezel-free display comprises a display substrate and an array of pixels. Pixel rows and pixel columns are separated by row and column distances and connected by row and column lines, respectively. A column driver is electrically connected to each of the column lines and a row driver is electrically connected to each of the row lines. Row-connection lines are electrically connected to each of the row lines or row drivers. In certain embodiments, each pixel in the column of pixels closest to a display substrate edge is spatially separated from the edge by a distance less than or equal to the column distance. At least one row driver is spatially separated from the corresponding row by a distance less than the column or row distance, at least one column driver is spatially separated from the corresponding column by a distance less than the column or row distance, or both.Type: GrantFiled: December 22, 2020Date of Patent: August 30, 2022Assignee: X Display Company Technology LimitedInventors: Ronald S. Cok, Brook Raymond
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Publication number: 20220232707Abstract: An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.Type: ApplicationFiled: March 28, 2022Publication date: July 21, 2022Inventors: Christopher Andrew Bower, Matthew Alexander Meitl, Brook Raymond, Salvatore Bonafede
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Patent number: 11393730Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.Type: GrantFiled: September 3, 2020Date of Patent: July 19, 2022Assignee: X Display Company Technology LimitedInventors: Ronald S. Cok, Erich Radauscher, Salvatore Bonafede, Christopher Andrew Bower, Matthew Alexander Meitl, Carl Ray Prevatte, Jr., Brook Raymond
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Patent number: 11387153Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.Type: GrantFiled: September 3, 2020Date of Patent: July 12, 2022Assignee: X Display Company Technology LimitedInventors: Ronald S. Cok, Erich Radauscher, Salvatore Bonafede, Christopher Andrew Bower, Matthew Alexander Meitl, Carl Ray Prevatte, Jr., Brook Raymond
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Publication number: 20220085235Abstract: A transfer-printable (e.g., micro-transfer-printable) device source wafer comprises a growth substrate comprising a growth material, a plurality of device structures comprising one or more device materials different from the growth material, the device structures disposed on and laterally spaced apart over the growth substrate, each device structure comprising a device, and a patterned dissociation interface disposed between each device structure of the plurality of device structures and the growth substrate. The growth material is more transparent to a desired frequency of electromagnetic radiation than at least one of the one or more device materials. The patterned dissociation interface has one or more areas of relatively greater adhesion each defining an anchor between the growth substrate and a device structure of the plurality of device structures and one or more dissociated areas of relatively lesser adhesion between the growth substrate and the device structure of the plurality of device structures.Type: ApplicationFiled: November 19, 2021Publication date: March 17, 2022Inventors: Brook Raymond, Christopher Andrew Bower, Matthew Meitl, Ronald S. Cok
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Patent number: 11233170Abstract: A transfer-printable (e.g., micro-transfer-printable) device source wafer comprises a growth substrate comprising a growth material, a plurality of device structures comprising one or more device materials different from the growth material, the device structures disposed on and laterally spaced apart over the growth substrate, each device structure comprising a device, and a patterned dissociation interface disposed between each device structure of the plurality of device structures and the growth substrate. The growth material is more transparent to a desired frequency of electromagnetic radiation than at least one of the one or more device materials. The patterned dissociation interface has one or more areas of relatively greater adhesion each defining an anchor between the growth substrate and a device structure of the plurality of device structures and one or more dissociated areas of relatively lesser adhesion between the growth substrate and the device structure of the plurality of device structures.Type: GrantFiled: January 30, 2020Date of Patent: January 25, 2022Assignee: X Display Company Technology LimitedInventors: Brook Raymond, Christopher Andrew Bower, Matthew Meitl, Ronald S. Cok
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Patent number: 11189605Abstract: A transparent display comprises a display substrate having a display area and a bezel area adjacent to each of at least one corresponding side of the display area. The display substrate is at least partially transparent. Light-controlling elements are disposed in, on, or over the display substrate in the display area. Display wires are disposed in, on, or over the display substrate in the display area. The display wires are electrically connected to the light-controlling elements. Bezel wires are disposed in, on, or over the display substrate in the bezel area, the bezel wires electrically connected to respective ones of the display wires. A bezel transparency in the bezel area is greater than or equal to a display transparency in the display area.Type: GrantFiled: February 28, 2018Date of Patent: November 30, 2021Assignee: X Display Company Technology LimitedInventors: Christopher Andrew Bower, Matthew Meitl, Brook Raymond, Erich Radauscher