Abstract: A thermal ground plane is disclosed that may comprise a first casing and a second casing. The outer periphery of the first casing and the outer periphery of the second casing may be bonded to each other with a hermetic seal and to create an internal cavity. A first wick may be bonded with the first casing. A second wick may be disposed within the internal cavity. The second wick may be bonded with the second casing. The liquid feed structure may be disposed between the first wick and the second wick. The liquid feed structure may allow liquid transport between the first wick and the second wick. The liquid feed structure may comprise a plurality of individual feed strips. A working fluid may be disposed within the internal cavity. The second casing, for example, may be shared with a cold plate or a heat sink.