Abstract: An axially arranged solid state semiconductor pressure sensor assembly is provided in which the semiconductor pressure sensing die is mounted on an internal sub-assembly which is functionally testable and which mates with a variety of different external sleeves individually adapted to attach in different ways to the vessel or system containing the pressure intended to measured. The sub-assembly comprises a cylindrical dielectric body having a platform parallel to the axis of the cylinder. The body contains electrical leads aligned parallel to the platform and extending from the region adjacent to the platform where wire bonds may be made directly to the sensor chip, to the opposite end of the body. A hole and channel arrangement is provided through the dielectric body to the central portion of the platform for communicating the reference pressure to the rear face of the semiconductor die.