Abstract: A communication device (110, 210) has an antenna (150, 152, 250, 252) positioned on a multilayer substrate/printed circuit board (154, 254, 254?). A first high frequency material (116, 216) is disposed over a first side of the substrate (154, 254) characterized for low frequency devices. A conductive layer (118, 218) is patterned over the first high frequency material (116, 216), defining first and second circuit traces (122, 124, 222, 224) and first and second antenna traces (132, 134, 232, 234). The first and second antenna traces (132, 134, 232, 234) define a first slot (116, 216) in the first conductive layer (122, 222), which is aligned with a cutout (162, 262) defined by the substrate (154, 254). One of a transmitter (112, 212) and a receiver (114, 214) are disposed over the high frequency material (116, 216) and coupled to the edge emitting antenna (150, 250) by the first and second circuit traces (122, 124, 222, 224).

Abstract: A method of receiving an RF signal in a wireless communication device includes receiving (1002) a signal having a frequency greater than 10 gigahertz by at least two of a plurality of millimeter wave antennas (122, 124, 126, 128, 822, 824, 826, 828, 922, 924, 926, 928) positioned within the portable wireless communication device. A characteristic of the signal at each antenna (122, 124, 126, 128, 822, 824, 826, 828, 922, 924, 926, 928) is determined (1004) and at least one of the plurality of millimeter wave antennas (122, 124, 126, 128, 822, 824, 826, 828, 922, 924, 926, 928) is selected (1006) based on the characteristics. The signal from the selected millimeter wave antenna (122, 124, 126, 128, 822, 824, 826, 828, 922, 924, 926, 928) is forwarded (1008) to a device controller 104. A combination of signals from the plurality of antennas may be evaluated prior to selecting two or more of the antennas (122, 124, 126, 128, 822, 824, 826, 828, 922, 924, 926, 928).

Abstract: A communication device (110, 210) has an antenna (150, 152, 250, 252) positioned on a multilayer substrate/printed circuit board (154, 254, 254?). A first high frequency material (116, 216) is disposed over a first side of the substrate (154, 254) characterized for low frequency devices. A conductive layer (118, 218) is patterned over the first high frequency material (116, 216), defining first and second circuit traces (122, 124, 222, 224) and first and second antenna traces (132, 134, 232, 234). The first and second antenna traces (132, 134, 232, 234) define a first slot (116, 216) in the first conductive layer (122, 222), which is aligned with a cutout (162, 262) defined by the substrate (154, 254). One of a transmitter (112, 212) and a receiver (114, 214) are disposed over the high frequency material (116, 216) and coupled to the edge emitting antenna (150, 250) by the first and second circuit traces (122, 124, 222, 224).

Abstract: A device (10) is provided for matching the CTE between substrates (12, 14), e.g., a semiconductor substrate and packaging material. The first substrate (12) has a first coefficient of thermal expansion and the second substrate (14) has a second coefficient of thermal expansion. At least two layers (16) of liquid crystal polymer are formed between the first substrate (12) and the second substrate (14), each layer having a unique coefficient of thermal expansion progressively higher in magnitude from the first substrate (12) to the second substrate (14).

Abstract: A packaging structure (10) is provided having a hermetic sealed cavity for microelectronic applications. The packaging structure (10) comprises first and second packaging layers (12, 28) forming a cavity. Two liquid crystal polymer (LCP) layers (16, 22) are formed between and hermetically seal the first and second packaging layers (12, 28). First and second conductive strips (18, 20) are formed between the LCP layers (16, 22) and extend into the cavity. An electronic device (24) is positioned within the cavity and is coupled to the first and second conductive strips (18, 20).

Abstract: A packaging structure (10) is provided having a hermetic sealed cavity for microelectronic applications. The packaging structure (10) comprises first and second packaging layers (12, 28) forming a cavity. Two liquid crystal polymer (LCP) layers (16, 22) are formed between and hermetically seal the first and second packaging layers (12, 28). First and second conductive strips (18, 20) are formed between the LCP layers (16, 22) and extend into the cavity. An electronic device (24) is positioned within the cavity and is coupled to the first and second conductive strips (18, 20).

Abstract: A device (10) is provided for matching the CTE between substrates (12, 14), e.g., a semiconductor substrate and packaging material. The first substrate (12) has a first coefficient of thermal expansion and the second substrate (14) has a second coefficient of thermal expansion. At least two layers (16) of liquid crystal polymer are formed between the first substrate (12) and the second substrate (14), each layer having a unique coefficient of thermal expansion progressively higher in magnitude from the first substrate (12) to the second substrate (14).

Abstract: In one embodiment, an improved transceiver assembly for a vehicle capable of detecting potentially hazardous objects is disclosed. The transceiver assembly comprises a tapered slot feed antenna for generating a beam and for detecting the beam as reflected from the potential hazards. The antenna is formed in or on a housing which also contains a parabolic dish that oscillates to sweep the beam of radiation towards the potential hazards outside of the vehicle. In a preferred embodiment, approximately 77 GHz radiation is generated from and detected by the antenna. The antenna is preferably formed on a printed circuit board (PCB) (substrate), which can include additional circuitry necessary to operate the antenna, and which is preferably mounted at an acute angle with respect to the housing to direct the beam at the parabolic dish.

Abstract: In one embodiment, an improved transceiver assembly for a vehicle capable of detecting potentially hazardous objects is disclosed. The transceiver assembly comprises a tapered slot feed antenna for generating a beam and for detecting the beam as reflected from the potential hazards. The antenna is formed in or on a housing which also contains a parabolic dish that oscillates to sweep the beam of radiation towards the potential hazards outside of the vehicle. In a preferred embodiment, approximately 77 GHz radiation is generated from and detected by the antenna. The antenna is preferably formed on a printed circuit board (PCB) (substrate), which can include additional circuitry necessary to operate the antenna, and which is preferably mounted at an acute angle with respect to the housing to direct the beam at the parabolic dish.

Abstract: According to the most preferred embodiments of the present invention, at least one of the two plates of a capacitor is formed in at least two different layers of an integrated circuit. The methods of the present invention uses “air bridges” or some other dielectric medium to isolate certain portions of the two capacitive plates of a capacitor where at least a portion of one of the capacitive plates passes over at least a portion of the other capacitive plate. The line widths, line separation and number of levels used in the topology of the capacitor will determine the overall capacitance value of a given structure.

Abstract: According to the most preferred embodiments of the present invention, at least one of the two plates of a capacitor is formed in at least two different layers of an integrated circuit. The methods of the present invention uses “air bridges” or some other dielectric medium to isolate certain portions of the two capacitive plates of a capacitor where at least a portion of one of the capacitive plates passes over at least a portion of the other capacitive plate. The line widths, line separation and number of levels used in the topology of the capacitor will determine the overall capacitance value of a given structure.

Abstract: A semiconductor structure comprises a monocrystalline silicon substrate, an amorphous oxide material overlying the monocrystalline silicon substrate, a monocrystalline perovskite oxide material overlying the amorphous oxide material, a monocrystalline compound semiconductor material overlying the monocrystalline perovskite oxide material, and a dielectric resonator contacting the monocrystalline compound semiconductor material.

Abstract: Controlling and controlled components are integrated on a monolithic device. High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.