Abstract: Oil normally having refrigerant gas entrained therein is drawn from a sump. A portion of the oil is returned to the sump to agitate the oil in the sump to enhance gas separation therefrom. The remainder of the oil is subjected to centrifugal separation to remove the entrained refrigerant. The separated refrigerant is vented while the separated oil is fed to the lubrication system where contaminant removal takes place.

Abstract: Oil is subjected to at least one centrifugal separation to remove contaminants prior to its being supplied to the lubricating system. Additionally, there is at least a portion of the flow that is returned to the sump after separation without its being circulated for lubricating purposes. All of the contaminant collection areas are in a noncritical area in an area of continuous flow and located so as not to return contaminants to the oil sump.

Abstract: A capacity control for a multi-cylinder refrigeration compressor includes a modulating valve disposed between a suction manifold and less than all of the cylinders of the refrigeration compressor. The modulating valve regulates the flow of refrigerant gas from the manifold to the cylinders in communication therewith, with the valve functioning to increase the flow of refrigerant gas to the cylinders as the load on the refrigeration unit increases and to decrease the flow of refrigerant as the load on the refrigeration unit decreases.

Abstract: Apparatus for modulating the capacity of a reciprocating compressor having a cylinder chamber and a valve assembly extending over the cylinder chamber, defining fluid inlet and outlet paths, and including a suction valve for regulating vapor flow through the inlet path. The capacity modulating apparatus comprises a lever, a fulcrum, and control means. The lever extends through the fluid inlet path and above the suction valve, and has a first end located outside the valve assembly and a second end engaging the suction valve. Both the fulcrum and the control means engage the lever, and the control means is provided for applying a variable force to the lever wherein the lever transmits the force to the suction valve to urge the suction valve to an open position.

Abstract: A multi-compressor system comprising first and second stage motor-compressor units, a low pressure line for transmitting vapor from a source thereof to the first stage unit, an intermediate pressure line for transmitting vapor between the first and second stage units, a high pressure line for transmitting vapor from the second stage unit, and a bypass line for transmitting vapor from the low pressure line to the intermediate pressure line to selectively bypass the first stage unit. The first stage unit includes a first supply of lubricant, a first compressor, and a first lubricant overflow passage for passing overflow lubricant from the first supply thereof into the first compressor. The second stage unit includes a second supply of lubricant, a second compressor, and a second lubricant overflow passage for passing overflow lubricant from the second supply thereof into the second compressor.

Abstract: An adjustable clamp has its main bar formed from flat metal strip with serrations in one edge and a fixed arm may be formed by a bent-around end of this strip. The moving arm can be formed from two flat stampings from strip and a fine adjustment is provided by a screw on this arm, engaging the non-serrated edge of the bar, while the coarse adjustment is provided by a bush or pin between the stampings engaging the serrated edge.

Abstract: Substrate heating during sputter coating, due to charged particles, is controlled by the use of an auxiliary magnet in the vicinity of the substrate. The magnet is arranged to either increase this charge particle flux, in situations in which additional heating is desired, or reducing this charge particle flux in situations in which heating is detrimental (e.g., the sputter coating of heat sensitive substrates such as polymer films).

Abstract: A method is disclosed for making precisely patterned platinum films in the manufacture of integrated circuit devices. The method calls for the deposition of a film of a platinum compound, whose heat of formation is in the range of from -100 to +10 Kcal/mole, patterning the film, and thermally reducing the patterned film to platinum metal.

Abstract: The specification describes a procedure for multilevel metallization of semiconductor integrated circuits in which the severity of the step formed by the edges of the first level pattern and the intermediate insulator over which the second level metallization pattern extends is reduced by beveling the edge. The bevel occurs during selective etching of the first level metal as a consequence of depositing the first level metal over a range of diminishing temperatures. Metal layers, notably aluminum, deposited in this way exhibit a differential etch rate such that the layer etches more slowly as etching proceeds through the thickness of the layer. Bevels of the order of 30.degree. to the horizontal can be produced in this way.

Abstract: High-resolution sputter etching of a relatively thick layer (of, for example, gold) by directly utilizing a relatively thin layer of resist as a sputter-etching mask is often not feasible. In such a case, it is known to use a sputter-etching mask made of an etch-resistant material such as titanium interposed between the resist and the relatively thick layer. In accordance with the invention, patterning of the titanium is achieved by a technique of sputter etching in a halocarbon atmosphere.

Abstract: In high resolution lithography, resolution impairment sometimes occurs due to dust collecting on the mask. The dust is often attracted to the mask by static electricity. The solution proposed is to coat the entire photomask with a transparent, electrically conductive coating. The coating is electrically grounded to drain static charge. Conductive materials are often used for lithographic masks, but the patterns cannot be grounded effectively because there are island regions in the pattern.If the pattern is itself conducting, there is the added option of applying the antistatic layer under the pattern.If the pattern is formed of a photographic emulsion of a patterned photoresist, it is protected from damage and wear in handling by the harder conductive coating.