Abstract: An azeotrope spray cooling system for utilizing an azeotrope coolant for improving the performance of a spray cooling system. An azeotrope coolant is utilized within a two-phase thermal management system for thermally managing one or more heat producing devices. The characteristics of the azeotrope coolant may be adjusted for various types of thermal management applications by altering the components of the azeotrope coolant.

Abstract: In accordance with one embodiment of the present disclosure an apparatus includes a means for converting a first type of electrical power to a second type of electrical power. The apparatus also includes a means for spraying a coolant on the means for converting.

Abstract: A spray chamber valve control system for ensuring that coolant is sufficiently available at the intakes of pumps in a spray cooled environment regardless of the attitude, acceleration or deceleration of a spray chassis. The spray chamber valve control system includes a spray chassis with an interior portion for spray cooling electronic devices, a plurality of valves positioned within the inner corners of the spray chassis, and a control unit in communication with the valves for controlling the operation thereof. The control unit ensures that at least one valve is open at all times. The control unit also provides a recovery routine for when only one valve is open during a valve state change.

Abstract: An azeotrope spray cooling system for utilizing an azeotrope coolant for improving the performance of a spray cooling system. An azeotrope coolant is utilized within a two-phase thermal management system for thermally managing one or more heat producing devices. The characteristics of the azeotrope coolant may be adjusted for various types of thermal management applications by altering the components of the azeotrope coolant.

Abstract: Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor are described. One exemplary aspect provides a power semiconductor device including a semiconductive substrate having a surface; and a power transistor having a planar configuration and comprising a plurality of electrically coupled sources and a plurality of electrically coupled drains formed using the semiconductive substrate and adjacent the surface.

Abstract: Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor are described. One exemplary aspect provides a power semiconductor device including a semiconductive substrate having a surface; and a power transistor having a planar configuration and comprising a plurality of electrically coupled sources and a plurality of electrically coupled drains formed using the semiconductive substrate and adjacent the surface.

Abstract: Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor are described. One exemplary aspect provides a power semiconductor device including a semiconductive substrate having a surface; and a power transistor having a planar configuration and comprising a plurality of electrically coupled sources and a plurality of electrically coupled drains formed using the semiconductive substrate and adjacent the surface.

Abstract: Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor are described. One exemplary aspect provides a power semiconductor device including a semiconductive substrate having a surface; and a power transistor having a planar configuration and comprising a plurality of electrically coupled sources and a plurality of electrically coupled drains formed using the semiconductive substrate and adjacent the surface.

Abstract: Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor are described.

Abstract: Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor are described.

Abstract: A liquid pump with a brushless motor constructed to be received within a liquid reservoir of a cooling system to deliver liquid coolant under pressure to a manifold assembly through which the coolant is discharged onto various electronic components to cool them. The pump has a pumping assembly, a rotor, a stator and an electronic control circuit which controls the operation of the pump and each of which is immersed in liquid coolant in the pump housing to cool them as the coolant flows through the pump. Further, because each component within the pump can be exposed to the liquid in the pump, no sealed enclosures are needed for the pump as a whole or for any component therein and the pump can be received directly in the reservoir.

Abstract: Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor are described.

Abstract: Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor are described. One exemplary aspect provides a power semiconductor device including a semiconductive substrate having a surface; and a power transistor having a planar configuration and comprising a plurality of electrically coupled sources and a plurality of electrically coupled drains formed using the semiconductive substrate and adjacent the surface.

Abstract: Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor are described.

Abstract: Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor are described.

Abstract: An EMI shielding fluid control shroud is adapted for use in spray cooling EMI producing or EMI sensitive components. The EMI shielding shroud, carried between a printed circuit board and a spray plate, defines an interior spray cavity which prevents interference with coolant spray directed at one or more heat-generating, EMI producing or sensitive components, such as integrated circuits. The size and shape of the shroud provide control over the flow and direction of the coolant spray and result in better cooling of the components carried on the printed circuit board and partially enclosed by the shroud. The shroud provides an EMI shield which prevents passage by EMI in either direction, while allowing coolant fluid to exit through the EMI shielding material.

Abstract: A subscriber unit for a wireless digital telephone system is disclosed. An equalizer for receiving I and Q samples is disclosed which is in the form. The I and Q samples are complex sample pairs provided at a frequency. The equalizer receives a training signal in the form of complex I and Q sample pairs. A training signal is affected by undesirable characteristics that might be present in the I and Q samples. A comparator compares the actual input training signal with the desired output to obtain a set of weighting coefficients for the equalizer to produce the desired output. A frequency correction circuit provides a corrected frequency signal for the frequency of the sample pairs from the weighting coefficients.

Abstract: A packaging and cooling system for one or more semi-conductor devices provides a casement defining a die chamber carrying a peripherally positioned power board with pre-attached multi-functional power pins communicating to medially positioned dies. The power pins provide not only improved power supply but also provide heat transfer from and mechanical support for the die. The die with an attached power supply plane and heat spreader is flip mounted on the power pins. The casement defines channels for coolant between the power board and dies and outwardly of the heat spreader. A closed cooling system provides a fluidic coolant to an input plenum from which it is sprayed into the die chamber channels for evaporative cooling therein on both sides of contained dies and about the power pins with subsequent recovery and recycling. The asymmetrical architecture within the die chamber allows less restricted thermal expansion of the various components than would result from common symmetrical architecture.

Abstract: A liquid fuel injection device for internal combustion engines provides an elongate peripheral injector housing defining a cylindrical medial chamber with a fluid plenum having a fluid inlet at a first end and plural fluid exit ports at a second end that is carried within a combustion chamber of an engine cylinder. The plural exit ports are spacedly arrayed in both circumferential and axial directions and may be angularly oriented in the injector housing. The medial chamber of the injector housing rotatably carries an atomizer casement defining an internal chamber with plural circumferentially spaced inlet orifices at a first end which communicates with the fluid plenum of the first end of the injector housing and plural spray orifices at the second end.

Abstract: In a wireless digital telephone system, a circuit for determining in a subscriber unit whether a particular RF channel is of the type designated by the base station to be either a control channel or a voice channel and for determining whether the channel is in the transmit or receive mode; the circuit utilizing the duration of an AM hole to determine the type of the channel and utilizing a unique word for determining the mode.