Patents by Inventor Bruce A. Waver

Bruce A. Waver has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaged adhesive mass
    Patent number: 6230890
    Abstract: A method for packaging a hot melt adhesive mass comprises providing a hot melt adhesive having a predetermined viscosity and finite size and shape, and encapsulating the hot melt adhesive in a polymeric shrink wrap which forms a hermetic seal thereon. An packaged adhesive mass comprises a hot melt adhesive having a predetermined viscosity and a finite size and shape; and a polymeric shrink wrap film which encapsulates the hot melt adhesive. The hot melt adhesive is hermetically sealed.
    Type: Grant
    Filed: February 16, 2000
    Date of Patent: May 15, 2001
    Assignee: Reichhold Chemicals, Inc.
    Inventors: Bruce A. Waver, David E. Mechling, Barclay S. Hickman, Leon Bildusas
  • Method of preparing a hot melt adhesive
    Patent number: 6044625
    Abstract: A method for packaging a hot melt adhesive mass comprises providing a hot melt adhesive having a predetermined viscosity and finite size and shape, and encapsulating the hot melt adhesive in a polymeric shrink wrap which forms a hermetic seal thereon. An packaged adhesive mass comprises a hot melt adhesive having a predetermined viscosity and a finite size and shape; and a polymeric shrink wrap film which encapsulates the hot melt adhesive. The hot melt adhesive is hermetically sealed.
    Type: Grant
    Filed: March 25, 1998
    Date of Patent: April 4, 2000
    Assignee: Reichhold Chemicals, Inc.
    Inventors: Bruce A. Waver, David E. Mechling, Barclay S. Hickman, Leon Bildusas
  • Methods and apparatus for preparing a hot melt adhesive
    Patent number: 6006497
    Abstract: Methods and apparatus for preparing a hot melt adhesive for packaging and for packaging same and a packaged, hot melt adhesive product are provided according to the present invention. Particularly, methods and apparatus are provided for rapidly chilling and dusting a hot melt adhesive mass to provide chilled, dusted hot melt adhesive masses which can be packaged without necessitating additional packaging around or between individual masses. A resulting packaged, hot melt adhesive product includes hot melt adhesive masses packaged without necessitating packaging around or between individual masses to prevent the masses from adhering to adjacent masses or shipping containers. The hot melt adhesive masses can be removed from a shipping container and directly inserted into a hot melt adhesive processing unit for various applications without requiring removal or disposal of additional packaging.
    Type: Grant
    Filed: March 26, 1997
    Date of Patent: December 28, 1999
    Assignee: Reichhold Chemicals, Inc.
    Inventors: Bruce A. Waver, David E. Mechling, Barclay S. Hickman