Patents by Inventor Bruce Alan Huing

Bruce Alan Huing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7566967
    Abstract: In one embodiment, a semiconductor package structure includes a plurality of upright clips having ends with mounting surfaces for vertically mounting the package to a next level of assembly. A semiconductor chip is interposed between the upright clips together with one or more spacers.
    Type: Grant
    Filed: January 22, 2008
    Date of Patent: July 28, 2009
    Assignee: Semiconductor Components Industries, L.L.C.
    Inventors: Stephen St. Germain, Francis J. Carney, Bruce Alan Huing