Abstract: Intra-field distortion for a projection imaging tool is determined using a self-referenced rectangular grid reticle pattern, that includes at least two arrays of alignment attributes that are complementary to each other, is exposed multiple times onto a substrate with a recording media. A reference reticle pattern is exposed onto the substrate, wherein the reference reticle pattern overlaps the grid alignment attributes thereby creating completed grid alignment attributes. Positional offsets of the completed alignment attributes and completed grid alignment attributes are measured and an intra-field distortion from the offsets is determined.

Abstract: A method and apparatus for front to back substrate registration is described. Alignment characteristics of features on surfaces of substrates can be used to physically align substrates with a multiplicity of integrated alignment optics. Measurement of offsets of the integral alignment optics are used to compute registration data for use in calibration of the substrate global alignment.

Abstract: Techniques for determining wafer stage grid and yaw in a projection imaging tool are described. The techniques include exposing an overlay reticle onto a substrate having a recording media, thereby creating a plurality of printed fields on the substrate. The overlay reticle is then positioned such that when the reticle is exposed again completed alignment attributes are created in at least two sites in a first and a second printed field. The substrate is then rotated relative to the reticle by a desired amount. The overlay reticle is then positioned such that when the reticle is again exposed, completed alignment attributes are created in at least two sites in the first and a third printed field. Measurements of the complementary alignment attribute and a dynamic intra-field lens distortion are then used to reconstruct wafer stage grid and yaw error of the projection imaging system.

Abstract: A reticle stage grid and yaw in a projection imaging tool is determined by exposing a first portion of a reticle pattern onto a substrate with a recording media thereby producing a first exposure. The first portion of the reticle pattern includes at least two arrays of alignment attribute that have features complementary to each other. The reticle stage is then shifted and a second portion of the reticle pattern is exposed. The first and second exposures overlap and interlock to create completed alignment attributes. Measurements of positional offsets of the completed alignment attributes are used to determine the reticle stage grid and yaw.

Abstract: A process of measuring the radiant intensity profile of an effective source of a projection image system that has an effective source, an object plane, an imaging objective, an exit pupil, and an image plane. The improved process consists of selecting at least one field point and a corresponding aperture plane aperture and projecting a plurality of images of the selected field point through the corresponding selected aperture plane aperture at a plurality of various intensities of the effective source. By analyzing the recorded images of the effective source at various intensities it is possible to determine a radiant intensity profile of the image source at the selected field point.

Abstract: A process of measuring the radiant intensity profile of an effective source of a projection image system that has an effective source, an object plane, an imaging objective, an exit pupil, and an image plane. The improved process consists of selecting at least one field point and a corresponding aperture plane aperture and projecting a plurality of images of the selected field point through the corresponding selected aperture plane aperture at a plurality of various intensities of the effective source. By analyzing the recorded images of the effective source at various intensities it is possible to determine a radiant intensity profile of the image source at the selected field point.

Abstract: A device, method of measurement and method of data analysis are described for imaging and quantifying in a practice sense the luminous intensity of the effective illumination source of an image system. The device, called a source metrology instrument, produces images and other quantitative measurements of the combined condenser and light source that are taken in-situ and without any significant alteration of the optical or mechanical set up. As such, the device can be used to monitor and assess the coherence properties of the illumination source with a minimum of interruptions to the optical tools productive time. It can be used with photolithographic step and repeat reduction or nonreducing imaging systems (steppers), scanning image systems, fixed field step and repeat aberration systems, scanning aberration systems, or any other projection imaging or aberration systems.

Abstract: A technique for mapping working images to adjacently and continuously tiled subapertures having CGHs on a plate is disclosed with the result that the entirety of a working area of a plate is completely covered with working subapertures, these subapertures usually being rectangular. The design technique thereafter determines a phase function which approximately maps desired regions on each subaperture from portions of the working image in the workpiece plane. Steps in the process include first a determination of the size and shape of subapertures representing each feature. Second, a determination of the geometric transformation for each feature is made. Thereafter, backpropagation or other refinement to create the desired intensity profile at the workpiece is made.

Abstract: An apparatus and process for generating precision ink jet nozzle arrays in substrates is disclosed. The apparatus includes laser output through an alignment path, power monitor, expansion telescope and scanner. Preferably, beam division optics are used in conjunction with the scanner to divide out a plurality of beams and scan simultaneously a corresponding plurality of computer generated holograms (CGHs). These computer generated holograms are configured and scanned so that the generated image--preferably in the first order of diffraction--produces at least a row of ink jet holes having precision dimension and alignment preferably without optical interference from other diffraction orders. Utilizing the disclosed process and apparatus, a one step system is disclosed for going from a substrate to a finished nozzle array suitable for use with ink jet printers.

Abstract: A reticle consisting of a multiplicity of small openings corresponding to separate and distinguishable points is put in the reticle plane. This reticle is imaged down through an opening O in aperture plate AP. A corresponding multiplicity of spots are created at the image plane of the optical system. These spots have spot centroids relative to the original separate and distinguishable points in the reticle. These points, however, are deviated from their diffraction limited positions by the average of grad.phi.(u)) over the corresponding ray bundle. The opening O in the aperture plate samples a discrete portion of the entrance pupil. With points spread out over an area of size 2*NAo*za, ray bundles with chief rays covering the entire entrance pupil will be projected down to image plane IP. The above outlined procedure is extended to analyzing the wavefront at a multiplicity of field points over the entire lens train. The process includes using an aperture plate AP consisting of a multiplicity of openings O.

Abstract: A stepper lens train is mapped for curvature of field and distortion. A single plate, displaced from the reticle plane, is utilized for stepper correction. The plate is provided with a variable thickness mapped to correct curvature of field. The same plate is etched with stepped gratings typically on a flat surface of the plate.

Abstract: A reticle consisting of a multiplicity of small openings corresponding to separate and distinguishable points is put in the reticle plane. This reticle is imaged down through an opening O in aperture plate AP. A corresponding multiplicity of spots are created at the image plane of the optical system. These spots have spot centroids relative to the original separate and distinguishable points in the reticle. These points, however, are deviated from their diffraction limited positions by the average of grad .phi.(u)) over the corresponding ray bundle. The opening O in the aperture plate samples a discrete portion of the entrance pupil. With points spread out over an area of size 2*NAo*za, ray bundles with chief rays covering the entire entrance pupil will be projected down to image plane IP. The above outlined procedure is extended to analyzing the wavefront at a multiplicity of field points over the entire lens train. The process includes using an aperture plate AP consisting of a multiplicity of openings O.

Abstract: The process of the manufacture of both the conductive layers and dielectric layers of multichip modules of the deposited variety is set forth with direct etch techniques being substituted for photolithography. Simply stated, entire circuit layers of the modules are directly etched or patterned with the circuit configuration required. Three processes are disclosed for processing the individual layers including subtractive patterning of a metallic conductor layer and direct patterning of the dielectric layer; direct etch metal processing (DEMI) involving direct removal of the metal layer with subsequent direct patterning of the dielectric layer; and, plating form process involving additive metallization and direct etching of the dielectric layer. By utilizing the disclosed processes alone or in combination, fabrication of multichip modules can occur.

Abstract: A stepper configuration is modified by corrector plates so that an image from a reticle plane is projected to an ideal image at an object plane. The system correction is based on the premise that depth of field correction made at the reticle plane induces insignificant distortion correction. Further, distortion correction in turn induces insignificant changes in field correction. The preferred location of plates correcting for depth of field is therefore at the reticle plane, it being noted that distortion introduced by a field corrector plate at this location is negligible. Three generalized cases for correction are therefore discussed. The first case is field curvature correction where the correcting plate is registered to or close to the reticule plate; it is shown that induced distortion correction may be ignored. The second case is where field correction cannot be placed next to the reticle plate, but the field curvature induced by required distortion correction is negligible.

Abstract: Optical machining of a workpiece with coherent light scanning a plate with a plurality of subaperture subapertures is disclosed. Each of the subapertures creates a working image which when scanned with a coherent wave front of the design frequency forms in three dimensional space the working image. The working image when registered to a workpiece effect processing of the workpiece, usually ablating an aperture such as a blind via of small dimension. Improved techniques of dimensioning and fabricating the subaperture, creating amplitude modulation with the phase plate, and finally controlling amplitude with optical features close to the limit of producible optical elements is disclosed. The apparatus for the process, the process and the plate for utilization in the process are set forth.

Abstract: In an apparatus and process for the direct ablation of substrates, an optical train is disclosed which enables large substrates to be processed from relatively small optical masks containing subaperture groups. Optical masks, preferably in the form of transparent plates containing computer generated holograms, are provided with at least discrete subaperture groups for sequential scanning and hence sequential processing of the substrate. A scanning beam in combination with a variable aperture overlying the mask sequentially scans the subaperture groups of the plates to produce direct laser ablation from a subaperture group intended to be scanned and prevents partial scanning of adjacent subaperture groups. Specialized plates with overlying generally negative lenses and subapertures elongated with respect to the radial direction of optical divergence are utilized to project images out from under the respective computer generated holograms to locations at the side of the plates without distortion.

Abstract: Transparent and wholly transmissive optical plates are disclosed in which features to be ablated are formed to produce varying levels of transmission of an ablating laser beam, preferably scanned across the plate. Use of the plate for ablation extends to forming openings of varying depths with timed ablating exposures of known intensity. Alternately, the ablation profile of a single image can be controlled utilizing a timed exposure of known intensity to provide an ablated opening of a specific designed profile in a workpiece. Three specific plate image constructions are illustrated. These include gratings which taper in width (continuous and step tapers both being disclosed), randomly placed diffracting elements which taper in density, and gratings having interrupted portions which taper in density. Where the intensity across a feature is uniform, ablation to controlled depths may occur.

Abstract: A method and apparatus is disclosed for laser ablation of openings with a specified wall profile in materials such as polyimide. The method includes identifying the opening profile of choice. This profile of choice is then divided into convex portions which can be "stably" formed and concave portions which are "unstably" formed. With respect to convex portions of apertures, after ablation to their desired depth, these convex portions remain substantially unchanged with additional exposure to otherwise ablating radiation. With respect to concave portions of apertures, these concave portions change with additional exposure to ablating radiation. Accordingly, techniques are disclosed for controlling exposure to ablating radiation, controlling the profile of the ablating radiation, or both. In either case, the intensity profile of the working image containing the ablating light is shaped in accordance with the depth and slope of the sidewalls of the opening desired.

Abstract: The laser ablation control system and method described is active in starting laser ablation, continuing laser ablation and finally tuning laser ablation in view of product output. First, it provides a means of generating initial settings for laser ablation tool operation utilizing the high predictability of ablation on substrates of known composition. Second, it provides real time monitoring and control of the laser output in terms of the characteristics important to the system performance as it relates to the abalation process. Third, it entails statistical analysis of the photo ablated pattern with correspondent adjustment to abalation parameters. Most importantly, these elements are continuously combined to achieve optimized performance monitored during the ablation process.

Abstract: The process of the manufacture of both the conductive layers and dielectric layers of multichip modules of the deposited variety is set forth with direct etch techniques being substituted for photolithography. Simply stated, entire circuit layers of the modules are directly etched or patterned with the circuit configuration required. Three processes are disclosed for processing the individual layers including subtractive patterning of a metallic conductor layer and direct patterning of the dielectric layer; direct etch metal processing (DEMI) involving direct removal of the metal layer with subsequent direct patterning of the dielectric layer; and, plating form process involving additive metallization and direct etching of the dielectric layer. By utilizing the disclosed processes alone or in combination, fabrication of multichip modules can occur.