Abstract: A smoking detector having a body with a substrate which has a smoking particle capturing surface area positioned upon it. The particle capturing surface area is configured to attract and adhere to airborne smoking particles released in smoke emitted from burning tobacco or marijuana or a Vape device. Smoking particles captured within the particle capturing surface area will luminesce when exposed to UV light providing physical proof that smoking occurred in the room or vehicle where the detector was placed during a defined time period.

Abstract: A smoking detector having a body with a substrate which has a smoking particle capturing surface area positioned upon it. The particle capturing surface area is configured to attract and adhere to airborne smoking particles released in smoke emitted from burning tobacco or marijuana or a Vape device. Smoking particles captured within the particle capturing surface area will luminesce when exposed to UV light providing physical proof that smoking occurred in the room or vehicle where the detector was placed during a defined time period.

Abstract: The present invention provides a method for preparing a conforming shield enclosure for shielding a semiconductor device of an electronic component assembly comprising the steps of: (a) metalizing a sheet of a thermoformable polymer with an admixture of a conductive metal and a resin; and (b) thermoforming the metalized thermoformable polymer from step (a) to form a conforming shield enclosure; wherein the conforming shield enclosure has dimensions conforming to the inside of a housing of the electronic component assembly and enclosing and thereby shielding the semiconductor device from electromagnetic frequencies, wherein the conforming shield enclosure is prepared by paint metalization.

Abstract: The present invention is directed to electronic components shielded from electromagnetic interference through the use of conforming shield enclosures. Conforming shield enclosures are flexible metalized thermoformed thin-wall polycarbonate polymer film substrates used to shield a radiation source. The present invention relates to conforming shielded forms for electronic component assemblies and specifically to electronic component assemblies which are shielded to protect against electromagnetic and radiofrequency interference. Specifically, the shielded electronic component assembly comprises (a) a semiconductor device to be shielded from electromagnetic frequencies; (b) a reference potential source; (c) a housing enclosing the semiconductor device within the assembly; and (d) a conforming shield enclosure electrically connected to the reference potential source.

Abstract: The present invention is directed to electronic components shielded from electromagnetic interference through the use of conforming shield enclosures. Conforming shield enclosures are flexible metalized thermoformed thin-wall polycarbonate polymer film substrates used to shield a radiation source. The present invention relates to conforming shielded forms for electronic component assemblies and specifically to electronic component assemblies which are shielded to protect against electromagnetic and radiofrequency interference. Specifically, the shielded electronic component assembly comprises (a) a semiconductor device to be shielded from electromagnetic frequencies; (b) a reference potential source; (c) a housing enclosing the semiconductor device within the assembly; and (d) a conforming shield enclosure electrically connected to the reference potential source.

Abstract: The present invention is directed to electronic components shielded from electromagnetic interference through the use of conforming shield enclosures. Conforming shield enclosures are flexible metalized thermoformed thin-wall polycarbonate polymer film substrates used to shield a radiation source. The present invention relates to conforming shielded forms for electronic component assemblies and specifically to electronic component assemblies which are shielded to protect against electromagnetic and radiofrequency interference. Specifically, the shielded electronic component assembly comprises (a) a semiconductor device to be shielded from electromagnetic frequencies; (b) a reference potential source; (c) a housing enclosing the semiconductor device within the assembly; and (d) a conforming shield enclosure electrically connected to the reference potential source.

Abstract: The present invention is directed to electronic components shielded from electromagnetic interference through the use of conforming shield enclosures. Conforming shield enclosures are flexible metalized thermoformed thin-wall polycarbonate polymer film substrates used to shield a radiation source. The present invention relates to conforming shielded forms for electronic component assemblies and specifically to electronic component assemblies which are shielded to protect against electromagnetic and radiofrequency interference. Specifically, the shielded electronic component assembly comprises (a) a semiconductor device to be shielded from electromagnetic frequencies; (b) a reference potential source; (c) a housing enclosing the semiconductor device within the assembly; and (d) a conforming shield enclosure electrically connected to the reference potential source.