Abstract: An anode apparatus for mounting on an external surface of a concrete structure to provide cathodic protection of metal members in the concrete uses a pre-assembled body which is typically elongate carrying a longitudinal anode, which can be sacrificial or impressed current, together with a supporting material having a front face for attachment to the surface and an impermeable plastic covering material at the rear face covering the anode and the supporting material when the front face is attached to the surface of the concrete. A channel defined on the front face is arranged to receive a layer of a conformable ionically conductive adhesive material for attachment to the external surface. A distance of the edge of the covering material is arranged to be similar to a distance of the metal from the external surface such that wetting and drying effects of environmental moisture are the same for the anode as for the metal components.

Abstract: The present invention provides a method for automatically defining a part model for a semiconductor component. An image of the component is provided. The automatic method may be any of a trial and error method, systematic method or a method based on distance-angle signatures. The trial and error method is described in the context of defining a part model for a ball grid array. The systematic approach is described in the context of a leaded semiconductor, and the distance angle signature approach is described in the context of defining a part model for an odd form semiconductor component.

Abstract: The present invention provides a method for automatically defining a part model for a semiconductor component. An image of the component is provided. The automatic method may be any of a trial and error method, systematic method or a method based on distance-angle signatures. The trial and error method is described in the context of defining a part model for a ball grid array. The systematic approach is described in the context of a leaded semiconductor and the distance angle signature approach is described in the context of defining a part model for an odd form semiconductor component.