Abstract: A power conversion system comprising, three full wave LLC resonant converters each of which has an associated high frequency isolation transformer, a full wave rectifier and an unfolding inverter, to provide a direct connection to a Medium Voltage (MV) three-phase grid for a high power photovoltaic system.

Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: EMI shielding in an electric vehicle drive is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: A multi-layer power backplane system is disclosed for use with various power electronic and other systems. The power backplane includes multiple mechanical, conductor and isolation layers which serve to route power to and from various components. The layers are isolated from one another by support/isolation panels which may receive conductors used to route power. Data signals may also be routed through the system. The system accommodates fluid cooling of the electronic components by an additional layer of conduit support and isolation. The overall system provides a high degree of flexibility and modularity in defining a power backplane for a wide range of circuitry and components which may be mounted thereto once the power backplane is designed and assembled.

Abstract: A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Abstract: Magnetostrictive wire having a low surface-to-volume ratio established by a onstant non-planar cross-section, is helically deformed into contact with a shaft under a stress maintaining the wire in fixed relation to the shaft surface. Magnetic anisotropy is imparted to the wire by twist thereof about its cross-sectional axis while the wire is being helically deformed into contact with the shaft surface to form a torque sensor through which accurate torque detection is achieved.

Abstract: Magnetostrictive wire having a low surface-to-volume ratio established by a onstant non-planar cross-section, is helically deformed into contact with a shaft under a stress maintaining the wire in fixed relation to the shaft surface. Magnetic anisotropy is imparted to the wire by twist thereof about its cross-sectional axis while the wire is being helically deformed into contact with the shaft surface to form a torque sensor through which accurate torque detection is achieved.