Abstract: A method of forming an overmolded plastic structure on a metallic plate includes first bonding a component to the metallic plate. The component is bonded with an adhesive that adheres it to the metallic plate. A plastic structure is formed over at least a portion of the component and the metallic plate and the plastic structure primarily adheres to the component. The component can be a set of metallic signal conductors that are used to route electrical signals across the metallic plate and the adhesive can be used to electrically insulate the signal conductors from the metallic plate.

Abstract: Improved techniques are disclosed for housing electronic components. A first housing member can be made to have an exterior surface that covers a majority of the housing. The first housing member can be of unitary construction. The first housing member can be seamlessly constructed. The first housing member can be formed in one injection molding. An electrical power conduction pin can extend through an aperture in a cover plate, and can be arranged for mechanically coupling the cover plate with a major interior surface of the first housing member, so as to secure the cover plate to the first housing member.