Abstract: A method is disclosed in which a blind via in a PCB is filled. The vias are plated with a conductor and then with a fusible metal of lower melting point than the conductor. The plated vias are covered with a photoresist and the fusible metal is removed at locations on the PCB other than where the photoresist is disposed. The photoresist is removed and flux is provided on the PCB before the PCB is heated. The heated fusible metal flows into the via.

Abstract: A process for reforming a plastic packaged integrated circuit die (100) includes grinding away (305) a bottom side (210) of a plastic package (205) and portions of a set of leads (110) that are in the plane of the grinding until a bottom surface (240) of an inner portion (230) of the set of leads is exposed at a peripheral region (235) of the inner portion, cutting (310) approximately perpendicularly to the top and bottom sides to remove portions of the plastic package and the set of leads that are outside the inner portion of the set of leads, and adapting (320) the bottom surfaces of the inner portion of the set of leads for reliable electrical connections.

Abstract: A method of making a multilayer, printed wiring board may include pre-drilling a prepreg sheet to form a hole free of glass fibers. The hole has a first diameter. The method includes laminating the pre-drilled prepreg sheet between a copper foil and a substrate and allowing the hole to fill with resin from the prepreg sheet, patterning the copper foil to create an opening in a location associated with the resin-filled hole, drilling a via hole in the resin-filled hole, and metallizing the copper foil and the via hole. The via hole has a second diameter smaller than the first diameter.

Abstract: A process for reforming a plastic packaged integrated circuit die (100) includes grinding away (305) a bottom side (210) of a plastic package (205) and portions of a set of leads (110) that are in the plane of the grinding until a bottom surface (240) of an inner portion (230) of the set of leads is exposed at a peripheral region (235) of the inner portion, cutting (310) approximately perpendicularly to the top and bottom sides to remove portions of the plastic package and the set of leads that are outside the inner portion of the set of leads, and adapting (320) the bottom surfaces of the inner portion of the set of leads for reliable electrical connections.