Abstract: An augmented reality (AR) system for visualizing and modifying robot operational zones. The system includes an AR device such as a headset in communication with a robot controller. The AR device includes software for the AR display and modification of the operational zones. The AR device is registered with the robot coordinate frame via detection of a visual marker. The AR device displays operational zones overlaid on real world images of the robot and existing fixtures, where the display is updated as the user moves around the robot work cell. Control points on the virtual operational zones are displayed and allow the user to reshape the operational zones. The robot can be operated during the AR session, running the robot's programmed motion and evaluating the operational zones. Zone violations are highlighted in the AR display. When zone definition is complete, the finalized operational zones are uploaded to the robot controller.

Abstract: An augmented reality (AR) system for visualizing and modifying robot operational zones. The system includes an AR device such as a headset in communication with a robot controller. The AR device includes software for the AR display and modification of the operational zones. The AR device is registered with the robot coordinate frame via detection of a visual marker. The AR device displays operational zones overlaid on real world images of the robot and existing fixtures, where the display is updated as the user moves around the robot work cell. Control points on the virtual operational zones are displayed and allow the user to reshape the operational zones. The robot can be operated during the AR session, running the robot's programmed motion and evaluating the operational zones. Zone violations are highlighted in the AR display. When zone definition is complete, the finalized operational zones are uploaded to the robot controller.

Abstract: Techniques for efficiently setting up inspection, metrology, and review systems for operating upon semiconductor wafers are described. Specifically, this involves setting up recipes that allows each system to accurately inspect semiconductor wafers. The invention gathers pertinent information from these tools and presents the information to users in a way that greatly reduces the time required to complete a recipe. One system embodiment includes an inspection system and a review station that is communicatively linked such that the review station can read from and write to an entire set of data stored at the inspection system. The set of data includes image files of features detected by the inspection system.

Abstract: Techniques for efficiently setting up inspection, metrology, and review systems for operating upon semiconductor wafers are described. Specifically, this involves setting up recipes that allows each system to accurately inspect semiconductor wafers. The invention gathers pertinent information from these tools and presents the information to users in a way that greatly reduces the time required to complete a recipe. One system embodiment includes an inspection system and a review station that is communicatively linked such that the review station can read from and write to an entire set of data stored at the inspection system. The set of data includes image files of features detected by the inspection system.

Abstract: Techniques for efficiently setting up inspection, metrology, and review systems for operating upon semiconductor wafers are described. Specifically, this involves setting up recipes that allows each system to accurately inspect semiconductor wafers. The invention gathers pertinent information from these tools and presents the information to users in a way that greatly reduces the time required to complete a recipe. One system embodiment includes an inspection system and a review station that is communicatively linked such that the review station can read from and write to an entire set of data stored at the inspection system. The set of data includes image files of features detected by the inspection system.