Patents by Inventor Bruce Comstock

Bruce Comstock has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12102185
    Abstract: A midsole or insole device for a shoe includes a first variable stimulation mechanism positioned to interface one of the metatarsal heads and the heel and a second variable stimulation mechanism positioned to interface a lateral aspect of the foot between the fifth metatarsal head and the heel. During gait-related activities, the first variable stimulation mechanism produces stimulus of an intensity greater than the second variable stimulation mechanism. At least one of the first variable stimulation mechanism and the second variable stimulation mechanism comprises two bonded layers including a resilient stimulating upper layer and a less resilient stimulus-enhancing lower layer. The upper layer includes a plurality of holes that pass through the entirety of the upper layer, and the lower layer includes a plurality of equally spaced upwardly facing projections aligned substantially perpendicular to an upper surface of the upper layer.
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: October 1, 2024
    Assignee: Biopods Inc.
    Inventors: Bruce Comstock, Steve Horvath
  • Publication number: 20210337920
    Abstract: A midsole or insole device for a shoe includes a first variable stimulation mechanism positioned to interface one of the metatarsal heads and the heel and a second variable stimulation mechanism positioned to interface a lateral aspect of the foot between the fifth metatarsal head and the heel. During gait-related activities, the first variable stimulation mechanism produces stimulus of an intensity greater than the second variable stimulation mechanism. At least one of the first variable stimulation mechanism and the second variable stimulation mechanism comprises two bonded layers including a resilient stimulating upper layer and a less resilient stimulus-enhancing lower layer. The upper layer includes a plurality of holes that pass through the entirety of the upper layer, and the lower layer includes a plurality of equally spaced upwardly facing projections aligned substantially perpendicular to an upper surface of the upper layer.
    Type: Application
    Filed: July 13, 2021
    Publication date: November 4, 2021
    Inventors: Bruce Comstock, Steve Horvath
  • Patent number: 11058169
    Abstract: A midsole or insole device for a shoe includes a first variable stimulation mechanism positioned to interface one of the metatarsal heads and the heel and a second variable stimulation mechanism positioned to interface a lateral aspect of the foot between the fifth metatarsal head and the heel. During gait-related activities, the first variable stimulation mechanism produces stimulus of an intensity greater than the second variable stimulation mechanism. At least one of the first variable stimulation mechanism and the second variable stimulation mechanism comprises two bonded layers including a resilient stimulating upper layer and a less resilient stimulus-enhancing lower layer. The upper layer includes a plurality of holes that pass through the entirety of the upper layer, and the lower layer includes a plurality of equally spaced upwardly facing projections aligned substantially perpendicular to an upper surface of the upper layer.
    Type: Grant
    Filed: November 18, 2017
    Date of Patent: July 13, 2021
    Assignee: Biopods, LLC
    Inventors: Bruce Comstock, Steve Horvath
  • Publication number: 20180140041
    Abstract: A midsole or insole device for a shoe includes a first variable stimulation mechanism positioned to interface one of the metatarsal heads and the heel and a second variable stimulation mechanism positioned to interface a lateral aspect of the foot between the fifth metatarsal head and the heel. During gait-related activities, the first variable stimulation mechanism produces stimulus of an intensity greater than the second variable stimulation mechanism. At least one of the first variable stimulation mechanism and the second variable stimulation mechanism comprises two bonded layers including a resilient stimulating upper layer and a less resilient stimulus-enhancing lower layer. The upper layer includes a plurality of holes that pass through the entirety of the upper layer, and the lower layer includes a plurality of equally spaced upwardly facing projections aligned substantially perpendicular to an upper surface of the upper layer.
    Type: Application
    Filed: November 18, 2017
    Publication date: May 24, 2018
    Inventors: Bruce Comstock, Steve Horvath, Roy Gardiner