Abstract: Dynamic yield prediction. In accordance with a first method embodiment of the present invention, a computer-implemented method includes collecting sample test information from a plurality of test-only structures prior to completion of the first wafer, gathering finished test data from all die of the first wafer, after completion of the first wafer, constructing a yield prediction model based on the sample test information and on the finished test data, and predicting, using the model, a percentage of die of the first wafer that will meet a particular specification. The method may further include a feedback loop to dynamically update the model.

Abstract: Dynamic yield prediction. In accordance with a first method embodiment of the present invention, a computer-implemented method includes collecting sample test information from a plurality of test-only structures prior to completion of the first wafer, gathering finished test data from all die of the first wafer, after completion of the first wafer, constructing a yield prediction model based on the sample test information and on the finished test data, and predicting, using the model, a percentage of die of the first wafer that will meet a particular specification. The method may further include a feedback loop to dynamically update the model.

Abstract: A method for producing candidate fault circuitry in an integrated circuit (IC) is disclosed. The method comprises tracing back from at least one failing output of the IC to determine a corresponding fan-in cone for each failing output using simulation values obtained from a fault free simulation of a design of the IC. Further, it comprises determining a first set of suspect fault candidates for each failing output, wherein each suspect fault candidate potentially corresponds to a defective element in the IC. Next, it comprises tracing forward from each suspect in the first set to determine a second set of suspects, which is a narrower subset of the first set. Finally, it comprises identifying a failing block from the IC design, wherein the failing block comprises suspect fault candidates from the second set and can be simulated independently of the full design.

Abstract: A memory cell reconfiguration process is performed in accordance with the operational characteristic settings determined based upon the results of analysis and/or testing of memory cell operations. The memory circuit can include a plurality of memory cells and memory cell configuration controller. The memory cells store information associated with a variety of operations. The memory cell configuration controller coordinates selective enablement and disablement of each of the plurality of memory cells, which can be done on a subset or group basis (e.g., enables and/or disables memory cells on a word length or row by row basis). The address mapping can be adjusted so that the memory space appears continuous to external components. The memory cell configuration controller can also forward configuration information to upstream and/or downstream components that can adjust operations to compensate for the memory cell configuration (e.g., to prevent overflow).