Abstract: A computerized method and apparatus for automated printing based on a submitted print order from an internet storefront is presented. A user configures a pictorial workflow plan which can dynamically respond to a printing intent derived from the submitted print order. The workflow plan automatically generates a value for a printing process element based on the dynamic printing intent. The visual nature of the pictorial plan and the integration between the storefront and printing system provides a simplified environment for configuring and maintaining workflow plans corresponding to a wide range of orderable products and printing equipment.

Abstract: A structure and associated method for associated grouping of an alpha device with a plurality of dependent devices for a manufacturing test. The alpha device comprises at least one electrical characteristic. The plurality of dependent devices each comprise the at least one electrical characteristic. The alpha device and the plurality dependent devices are grouped together within a semiconductor device for an associated manufacturing test.

Abstract: A chip repair system designed for automated test equipment independent application on many unique very dense ASIC devices in a high turnover environment is disclosed. During test, the system will control on chip built-in self-test (BIST) engines collect and compress repair data, program fuses and finally decompress and reload the repair data for post fuse testing. In end use application this system decompresses and loads the repair data at power-up or at the request of the system.

Abstract: A chip repair system designed for automated test equipment independent application on many unique very dense ASIC devices in a high turnover environment is disclosed. During test, the system will control on chip built-in self-test (BIST) engines collect and compress repair data, program fuses and finally decompress and reload the repair data for post fuse testing. In end use application this system decompresses and loads the repair data at power-up or at the request of the system.

Abstract: It is, therefore, an object of the present invention to provide a structure and method of blowing fuses in a semiconductor chip that includes creating a design for the chip using a library, generating test data from the design, extracting the fuse related information from the design to prepare a fuse blow table, building the chip with the design data, testing the chip to produce failed data, comparing the fuse blow table to the failed data to determine the fuse blow location data, and blowing the selected fuses based on the fuse blow location data. The extraction method can include creating a fuse map file based upon a correlation between physical pin locations on the chip and different fuse macros within the design, wherein an order of fuses within the fuse blow table matches an order of fuses within the fuse map file.