Abstract: A dual channel ADC uses two digital to analog converters (DACs) and a single comparator to convert two analog input channels. One DAC is used for successive approximation, while the other DAC is used for calibration. The dual channel ADC allows for sampling and conversion of single-ended, pseudo-differential, and fully differential analog input signals while maintaining layout symmetry and reducing crosstalk without substantially increasing circuit area. The single comparator is used for converting both analog input channels. Additional logic (such as switches or digital logic) is used to connect the input sampling capacitors and DACs to the appropriate inputs of the comparator for converting the analog input channels.

Abstract: A dual channel ADC uses two digital to analog converters (DACs) and a single comparator to convert two analog input channels. One DAC is used for successive approximation, while the other DAC is used for calibration. The dual channel ADC allows for sampling and conversion of single-ended, pseudo-differential, and fully differential analog input signals while maintaining layout symmetry and reducing crosstalk without substantially increasing circuit area. The single comparator is used for converting both analog input channels. Additional logic (such as switches or digital logic) is used to connect the input sampling capacitors and DACs to the appropriate inputs of the comparator for converting the analog input channels.

Abstract: A bandgap reference voltage cell that produces a first-order and a second-order temperature-compensated reference voltage output includes four bipolar transistors. At least one of the four transistors is biased with a current having a different temperature coefficient than that of a current which biases at least the second of the four transistors. The first and second order temperature compensation to the reference voltage is realized within the bandgap cell itself.

Abstract: A technique for "marking" integrated-circuit (IC) chips so that, when large lots of the chips are drift-tested at different temperatues, each chip can be identified positively so as to be associated with the test data accumulated for the particular chip. The technique includes forming additional resistors on each IC chip with the resistors connected in series and to a voltage supply. The resistors are timmed at the wafer stage to produce at nodal points between the resistors voltages having magnitudes which uniquely identify each particular chip, thereby to permit part-identified tests to be performed after the chips have been packaged as parts ready for shipment.