Patents by Inventor Bruce E. Kornfeld

Bruce E. Kornfeld has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Three dimensional die packaging in multi-chip modules
    Patent number: 5495394
    Abstract: A multi-chip module wherein electrical components, such as integrated circuit devices, are packaged in a three dimensional arrangement. The multi-chip module includes a first, or upper, substrate including a signal layer formed on the top surface of the substrate and at least one integrated circuit device mounted to the top surface of the substrate and electrically connected to the signal layer. The module further includes a second, or internal, substrate, also including a first signal layer formed on the top surface of the substrate and at least one integrated circuit device mounted to the top surface of the substrate and electrically connected with the signal layer formed on the top surface of the second substrate. The second substrate includes a cavity through the substrate corresponding to each integrated circuit device mounted thereto.
    Type: Grant
    Filed: December 19, 1994
    Date of Patent: February 27, 1996
    Assignee: AT&T Global Information Solutions Company
    Inventors: Bruce E. Kornfeld, Arthur R. Alexander