Abstract: Rotating disk reactors, and methods of using such reactors, are described herein. The rotating disk reactors herein have a housing defining a cylindrical interior volume, the housing having at least one inlet and one gas outlet; a plurality of disks disposed within the housing with uniform spacing, each disk having a central axis aligned with a central axis of the interior volume, and each disk having a condition that can be used to stimulate a chemical reaction in a gas proximate to a surface of the disk; a rotor disposed along the central axis, and through a center, of at least some of the disks, the rotor extending outside the interior volume; and a motor located outside the interior volume and coupled to the rotor to rotate the rotor and the disks.

Abstract: A gas-phase reactor system for dissociating and reacting gas-phase molecules employs a novel combination of plasma and pyrolytic energy to achieve up to 500 times greater dissociation efficiency compared to existing plasma, pyrolytic, catalytic, or water-based remediation systems. Integrated with an adsorption bed, the system neutralizes and captures dissociated elements and molecular fragments to levels below 1 part per billion. The reactor's innovative design eliminates the need for downstream water scrubbing, carrier gases, plasma-enhancing gases, additional heat, or catalytic inputs, enabling true point-of-use remediation. This results in up to a 10-fold reduction in cost of ownership and facility footprint compared to conventional centralized remediation systems, offering a compact, efficient, and cost-effective solution for gas-phase molecular processing.

Abstract: A processing chamber such as a plasma etch chamber can perform deposition and etch operations, where byproducts of the deposition and etch operations can build up in a vacuum pump system fluidly coupled to the processing chamber. A vacuum pump system may have multiple roughing pumps so that etch gases can be diverted a roughing pump and deposition precursors can be diverted to another roughing pump. A divert line may route unused deposition precursors through a separate roughing pump. Deposition byproducts can be prevented from forming by incorporating one or more gas ejectors or venturi pumps at an outlet of a primary pump in a vacuum pump system. Cleaning operations, such as waferless automated cleaning operations, using certain clean chemistries may remove deposition byproducts before or after etch operations.

Abstract: A processing chamber such as a plasma etch chamber can perform deposition and etch operations, where byproducts of the deposition and etch operations can build up in a vacuum pump system fluidly coupled to the processing chamber. A vacuum pump system may have multiple roughing pumps so that etch gases can be diverted a roughing pump and deposition precursors can be diverted to another roughing pump. A divert line may route unused deposition precursors through a separate roughing pump. Deposition byproducts can be prevented from forming by incorporating one or more gas ejectors or venturi pumps at an outlet of a primary pump in a vacuum pump system. Cleaning operations, such as waferless automated cleaning operations, using certain clean chemistries may remove deposition byproducts before or after etch operations.

Abstract: A passive impact sensor for a projectile configured to explode, destroy with kinetic energy, embed or pass through an object with a closing velocity greater than 1,000 m/s. The passive impact sensor includes an energy generating system comprised of a crystalline structure that stores latent polarized electrical energy. The crystalline structure is responsive to an impact generated shock wave that propagates at least partially through the crystalline structure to consume and depolarize the crystalline structure and release at least a portion of the stored energy to generate a voltage pulse across output terminals. An onboard antenna is configured to transmit an RF pulse responsive to the voltage pulse (direct or integrated) external to the impact sensor (and projectile) before the sensor is destroyed by the shock wave. Multiple energy generating systems can be positioned either together or fore and aft and their voltage pulses summed to transmit the RF pulse.

Abstract: A passive impact sensor for a projectile configured to explode, destroy with kinetic energy, embed or pass through an object with a closing velocity greater than 1,000 m/s. The passive impact sensor includes an energy generating system comprised of a crystalline structure that stores latent polarized electrical energy. The crystalline structure is responsive to an impact generated shock wave that propagates at least partially through the crystalline structure to consume and depolarize the crystalline structure and release at least a portion of the stored energy to generate a voltage pulse across output terminals. An onboard antenna is configured to transmit an RF pulse responsive to the voltage pulse (direct or integrated) external to the impact sensor (and projectile) before the sensor is destroyed by the shock wave. Multiple energy generating systems can be positioned either together or fore and aft and their voltage pulses summed to transmit the RF pulse.

Abstract: Described herein are nitrated lipids and methods of making and using the nitrated lipids.