Patents by Inventor Bruce Fried

Bruce Fried has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated gesture sensor module
    Patent number: 10884551
    Abstract: An integrated gesture sensor module includes an optical sensor die, an application-specific integrated circuit (ASIC) die, and an optical emitter die disposed in a single package. The optical sensor die and ASIC die can be disposed in a first cavity of the package, and the optical emitter die can be disposed in a second cavity of the package. The second cavity can be conical or step-shaped so that the opening defining the cavity increases with distance from the upper surface of the optical emitter die. The upper surface of the optical emitter die may be higher than the upper surface of the optical sensor die. An optical barrier positioned between the first and second cavities can include a portion of a pre-molded, laminate, or ceramic package, molding compound, and/or metallized vias.
    Type: Grant
    Filed: May 13, 2014
    Date of Patent: January 5, 2021
    Assignee: Analog Devices, Inc.
    Inventors: Dipak Sengupta, Shrenik Deliwala, Ying Zhao, Bruce Fried, William Schoppee, Woodrow Beckford
  • INTEGRATED GESTURE SENSOR MODULE
    Publication number: 20140340302
    Abstract: An integrated gesture sensor module includes an optical sensor die, an application-specific integrated circuit (ASIC) die, and an optical emitter die disposed in a single package. The optical sensor die and ASIC die can be disposed in a first cavity of the package, and the optical emitter die can be disposed in a second cavity of the package. The second cavity can be conical or step-shaped so that the opening defining the cavity increases with distance from the upper surface of the optical emitter die. The upper surface of the optical emitter die may be higher than the upper surface of the optical sensor die. An optical barrier positioned between the first and second cavities can include a portion of a pre-molded, laminate, or ceramic package, molding compound, and/or metallized vias.
    Type: Application
    Filed: May 13, 2014
    Publication date: November 20, 2014
    Applicant: ANALOG DEVICES, INC.
    Inventors: Dipak Sengupta, Shrenik Deliwala, Ying Zhao, Bruce Fried, William Schoppee, Woodrow Beckford