Abstract: High frequency power amplification modules comprise a dielectric substrate supporting a stepped impedance transition coupled to the input of a power amplifier and a symmetrically disposed stepped impedance transition connected to the output of the power amplifier. The power amplification modules are oriented in an electromagnetic energy field so that input electromagnetic energy is coupled to the input of the power amplifier by the input side stepped impedance transition, amplified by the amplifier, and emitted from the module by the output side stepped impedance transition. A plurality of the power amplification modules may be organized into an array to provide a power combiner. The power amplification modules in the array may be linked by isolation impedances that decouple the modules in the array.

Abstract: An n-stage RF choke comprises a series connection of two or more inductors connected in series between a source and a load. The inductor closest to the source has the largest inductance and the inductance closest to the load has the smallest inductance. The inductances of any inductors between the inductor closest to the supply and the inductor closest to the load decrease as a function of distance from the supply. The junctions between the inductors in the series connection are shunted to ground by capacitors connected in series with resistors that provide a matched termination for increasing bandwidth by lowering circuit Q factors and eliminating resonant frequencies. The capacitor closest to the supply has the largest capacitance and the capacitor closest to the load has the smallest capacitance. Any intermediate capacitors decrease in capacitance as a function of distance from the supply. Such an arrangement provides a high impedance that isolates the load from the supply at a wide range of frequencies.

Abstract: A segmented stub has at least one serpentine signal path that increases the effective electrical length of the stub without increasing the overall physical length or area of the stub. This permits more compact monolithic millimeter-wave and microwave integrated circuit design.

Abstract: A multi layered high impedance structure presents a high impedance to multiple frequency signals, with a different frequency for each layer. Each layer comprises a dielectric substrate, and an array of radiating elements such as parallel conductive strips or conductive patches on the substrate's top surface, with a conductive layer on the bottom surface of the bottommost layer. The radiating elements of succeeding layers are vertically aligned with conductive vias extending through the substrates to connect the radiating elements to the ground plane. Each layer presents as a series of parallel resonant L-C circuits to an E field at a particular signal frequency, resulting in a high impedance surface at that frequency. The new structure can be used as the substrate for a microstrip patch antenna to provide an optimal electrical distance between the resonator and backplane at multiple frequencies.

Abstract: A multi layered high impedance structure presents a high impedance to multiple frequency signals, with a different frequency for each layer. Each layer comprises a dielectric substrate, and an array of radiating elements such as parallel conductive strips or conductive patches on the substrate's top surface, with a conductive layer on the bottom surface of the bottommost layer. The radiating elements of succeeding layers are vertically aligned with conductive vias extending through the substrates to connect the radiating elements to the ground plane. Each layer presents as a series of parallel resonant L-C circuits to an E field at a particular signal frequency, resulting in a high impedance surface at that frequency. The new structure can be used as the substrate for a microstrip patch antenna to provide an optimal electrical distance between the resonator and backplane at multiple frequencies.

Abstract: In the disclosed automobile inventory system and methods, automobile report data is received from information sources having incompatible data formats. The report data is reformatted in a uniform format. A vehicle identification number (VIN) for the automobile is decoded to produce a set of automobile attributes. Attributes are matched with received third party automobile report data. A photograph is selected to represent the automobile. The color of the selected photograph substantially matches an identified color of the automobile. A database is populated with database data, including the reformatted report data, attribute matching data, and data associated with the colorized photograph. The database data is filtered or modified based on at least one dealer business rule, and the database data is electronically communicated to a World Wide Web accessible server. The database data is updated in real time.

Abstract: A multi layered high impedance structure presents a high impedance to multiple frequency signals, with a different frequency for each layer. Each layer comprises a dielectric substrate, and an array of radiating elements such as parallel conductive strips or conductive patches on the substrate's top surface with a conductive layer on the bottom surface of the bottommost layer. The radiating elements of succeeding layers are vertically aligned with conductive vias extending through the substrates to connect the radiating elements to the ground plane. Each layer presents as a series of parallel resonant L-C circuits to an E field at a particular signal frequency, resulting in a high impedance surface at that frequency. The new structure can be used as the substrate for a microstrip patch antenna to provide an optimal electrical distance between the resonator and backplane at multiple frequencies.

Abstract: An improved waveguide wall structure and improved waveguide using the new wall structure as the interior walls of the waveguide. The wall structure comprises a sheet of dielectric material, a series of parallel conductive strips on one side of the dielectric material and a layer of conductive material on the other side. Multiple conductive vias are also included through the dielectric material and between the conductive layer and conductive strips. The new wall structure presents as a series of parallel L-C circuits to a transverse E field at resonant frequency, resulting in a high impedance surface. The wall structure can be used in waveguides that transmit a signal in one polarization or signals that are cross polarized. The new waveguide maintains a near uniform density E field and H field component, resulting in near uniform signal power density across the waveguide cross section.