Abstract: In one embodiment, a semiconductor package structure includes a plurality of upright clips having ends with mounting surfaces for vertically mounting the package to a next level of assembly. A semiconductor chip is interposed between the upright clips together with one or more spacers.

Abstract: In one embodiment, a semiconductor package structure includes a plurality of upright clips having ends with mounting surfaces for vertically mounting the package to a next level of assembly. A semiconductor chip is interposed between the upright clips together with one or more spacers.

Abstract: IA purge block is disclosed in which inlet, process, purge and vent ports are series connected in a ring or bridge. The channel or passageway connecting the inlet and purge ports comprises a flow sensor. The impedance to gas flow of each channel is different from the others. The impedances are chosen such that improper operating conditions cause an imbalance in the flow which is detected by the flow sensor. During normal operation of the system in which the purge block is used, the flow sensor acts as an excess flow detector by comparing the flow through itself with the flow through a parallel, but more restrictive, path within the purge block.