Patents by Inventor Bruce K. Furman
Bruce K. Furman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8927087Abstract: Bonding of substrates including metal-dielectric patterns on a surface with the metal raised above the dielectric, as well as related structures, are disclosed. One structure includes: a first substrate having a metal-dielectric pattern on a surface thereof, the metal-dielectric pattern including: a metal having a concave upper surface; and a dielectric having a substantially uniform upper surface, wherein the metal on the first substrate is raised above the dielectric on the first substrate; and a second substrate bonded with the first substrate, the second substrate including: a dielectric; and a metal positioned substantially below the dielectric of the second substrate, wherein the first substrate and the second substrate are bonded only at the metal from the first substrate and the metal from the second substrate.Type: GrantFiled: September 17, 2013Date of Patent: January 6, 2015Assignee: International Business Machines CorporationInventors: Kuan-Neng Chen, Bruce K. Furman, Sampath Purushothaman, David L. Rath, Anna W. Topol, Cornelia K. Tsang
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Publication number: 20140097543Abstract: Bonding of substrates including metal-dielectric patterns on a surface with the metal raised above the dielectric, as well as related structures, are disclosed. One structure includes: a first substrate having a metal-dielectric pattern on a surface thereof, the metal-dielectric pattern including: a metal having a concave upper surface; and a dielectric having a substantially uniform upper surface, wherein the metal on the first substrate is raised above the dielectric on the first substrate; and a second substrate bonded with the first substrate, the second substrate including: a dielectric; and a metal positioned substantially below the dielectric of the second substrate, wherein the first substrate and the second substrate are bonded only at the metal from the first substrate and the metal from the second substrate.Type: ApplicationFiled: September 17, 2013Publication date: April 10, 2014Applicant: International Business Machines CorporationInventors: Kuan-Neng Chen, Bruce K. Furman, Sampath Purushothaman, David L. Rath, Anna W. Topol, Cornelia K. Tsang
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Patent number: 8617689Abstract: Bonding of substrates including metal-dielectric patterns on a surface with the metal raised above the dielectric, as well as related structures, are disclosed. One method includes providing a first substrate having a metal-dielectric pattern on a surface thereof; providing a second substrate having a metal-dielectric pattern on a surface thereof; performing a process resulting in the metal being raised above the dielectric; cleaning the metal; and bonding the first substrate to the second substrate. A related structure is also disclosed. The bonding of raised metal provides a strong bonding medium, and good electrical and thermal connections enabling creation of three dimensional integrated structures with enhanced functionality.Type: GrantFiled: April 10, 2012Date of Patent: December 31, 2013Assignee: International Business Machines CorporationInventors: Kuan-Neng Chen, Bruce K. Furman, Sampath Purushothaman, David L. Rath, Anna W. Topol, Cornelia K. Tsang
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Publication number: 20130307139Abstract: Bonding of substrates including metal-dielectric patterns on a surface with the metal raised above the dielectric, as well as related structures, are disclosed. One method includes providing a first substrate having a metal-dielectric pattern on a surface thereof; providing a second substrate having a metal-dielectric pattern on a surface thereof; performing a process resulting in the metal being raised above the dielectric; cleaning the metal; and bonding the first substrate to the second substrate. A related structure is also disclosed. The bonding of raised metal provides a strong bonding medium, and good electrical and thermal connections enabling creation of three dimensional integrated structures with enhanced functionality.Type: ApplicationFiled: April 10, 2012Publication date: November 21, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Kuan-Neng Chen, Bruce K. Furman, Sampath Purushothaman, David L. Rath, Anna W. Topol, Cornelia K. Tsang
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Patent number: 8541299Abstract: An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.Type: GrantFiled: May 26, 2010Date of Patent: September 24, 2013Assignee: Ultratech, Inc.Inventors: Stephen Leslie Buchwalter, Bruce K. Furman, Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih
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Patent number: 8541291Abstract: An electrical structure and method for forming electrical interconnects. The method includes positioning a sacrificial carrier substrate such that a first surface of a non-solder metallic core structure within the sacrificial carrier substrate is in contact with a first electrically conductive pad. The first surface is thermo-compression bonded to the first electrically conductive pad. The sacrificial carrier substrate is removed from the non-solder metallic core structure. A solder structure is formed on a second electrically conductive pad. The first substrate comprising the non-solder metallic core structure is positioned such that a second surface of the non-solder metallic core structure is in contact with the solder structure. The solder structure is heated to a temperature sufficient to cause the solder structure to melt and form an electrical and mechanical connection between the second surface of the non-solder metallic core structure and the second electrically conductive pad.Type: GrantFiled: June 14, 2011Date of Patent: September 24, 2013Assignee: Ultratech, Inc.Inventors: Bruce K. Furman, Jae-Woong Nah
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Patent number: 8476773Abstract: An electrical structure including a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.Type: GrantFiled: May 26, 2010Date of Patent: July 2, 2013Assignee: International Business Machines CorporationInventors: Stephen Leslie Buchwalter, Bruce K. Furman, Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih
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Patent number: 8242010Abstract: An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.Type: GrantFiled: May 26, 2010Date of Patent: August 14, 2012Assignee: International Business Machines CorporationInventors: Stephen Leslie Buchwalter, Bruce K. Furman, Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih
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Patent number: 8241995Abstract: Bonding of substrates including metal-dielectric patterns on a surface with the metal raised above the dielectric is disclosed. One method includes providing a first substrate having a metal-dielectric pattern on a surface thereof; providing a second substrate having a metal-dielectric pattern on a surface thereof; performing a process resulting in the metal being raised above the dielectric; cleaning the metal; and bonding the first substrate to the second substrate. A related structure is also disclosed. The bonding of raised metal provides a strong bonding medium, and good electrical and thermal connections enabling creation of three dimensional integrated structures with enhanced functionality.Type: GrantFiled: September 18, 2006Date of Patent: August 14, 2012Assignee: International Business Machines CorporationInventors: Kuan-Neng Chen, Bruce K. Furman, Sampath Purushothaman, David L. Rath, Anna W. Topol, Cornelia K. Tsang
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Patent number: 8164192Abstract: An electrical structure and method for forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure and a first solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. A second portion of the non-solder metallic core structure is thermo-compression bonded to the second electrically conductive pad.Type: GrantFiled: January 5, 2011Date of Patent: April 24, 2012Assignee: International Business Machines CorporationInventors: Bruce K. Furman, Jae-Woong Nah
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Patent number: 8156998Abstract: The present invention is a patterned metal thermal interface. In one embodiment a system for dissipating heat from a heat-generating device includes a heat sink having a first surface adapted for thermal coupling to a first surface of the heat generating device and a thermal interface having at least one patterned surface, the thermal interface being adapted to thermally couple the first surface of the heat sink to the first surface of the heat generating device. The patterned surface of the thermal interface allows the thermal interface to deform under compression between the heat sink and the heat generating device, leading to better conformity of the thermal interface to the surfaces of the heat sink and the heat generating device.Type: GrantFiled: February 23, 2010Date of Patent: April 17, 2012Assignee: International Business Machines CorporationInventors: Bruce K. Furman, Sushumna Iruvanti, Paul A. Lauro, Yves C. Martin, Da Yuan Shih, Theodore G. Van Kessel, Wei Zou
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Patent number: 8043893Abstract: An electrical structure and method for forming electrical interconnects. The method includes positioning a sacrificial carrier substrate such that a first surface of a non-solder metallic core structure within the sacrificial carrier substrate is in contact with a first electrically conductive pad. The first surface is thermo-compression bonded to the first electrically conductive pad. The sacrificial carrier substrate is removed from the non-solder metallic core structure. A solder structure is formed on a second electrically conductive pad. The first substrate comprising the non-solder metallic core structure is positioned such that a second surface of the non-solder metallic core structure is in contact with the solder structure. The solder structure is heated to a temperature sufficient to cause the solder structure to melt and form an electrical and mechanical connection between the second surface of the non-solder metallic core structure and the second electrically conductive pad.Type: GrantFiled: September 14, 2007Date of Patent: October 25, 2011Assignee: International Business Machines CorporationInventors: Bruce K. Furman, Jae-Woong Nah
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Publication number: 20110240279Abstract: The present invention is hybrid liquid metal-solder thermal interface. In one embodiment, a thermal interface for coupling a heat generating device to a heat sink includes a first metal interface layer, a second metal interface layer, and an isolation layer positioned between the first metal interface layer and the second metal interface layer, where at least one of the first metal interface layer and the second metal interface layer comprises a liquid metal.Type: ApplicationFiled: March 30, 2010Publication date: October 6, 2011Applicant: International Business Machines CorporationInventors: BRUCE K. Furman, Paul A. Lauro, Yves C. Martin, Robert L. Sandstrom, Da-Yuan Shih, Theodore G. Van Kessel
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Publication number: 20110239458Abstract: An electrical structure and method for forming electrical interconnects. The method includes positioning a sacrificial carrier substrate such that a first surface of a non-solder metallic core structure within the sacrificial carrier substrate is in contact with a first electrically conductive pad. The first surface is thermo-compression bonded to the first electrically conductive pad. The sacrificial carrier substrate is removed from the non-solder metallic core structure. A solder structure is formed on a second electrically conductive pad. The first substrate comprising the non-solder metallic core structure is positioned such that a second surface of the non-solder metallic core structure is in contact with the solder structure. The solder structure is heated to a temperature sufficient to cause the solder structure to melt and form an electrical and mechanical connection between the second surface of the non-solder metallic core structure and the second electrically conductive pad.Type: ApplicationFiled: June 14, 2011Publication date: October 6, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bruce K. Furman, Jae-Woong Nah
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Patent number: 7978473Abstract: A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.Type: GrantFiled: February 17, 2010Date of Patent: July 12, 2011Assignee: International Business Machines CorporationInventors: Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Bruce K. Furman, Madhusudan K. Iyengar, Paul A. Lauro, Roger R. Schmidt, Da-Yuan Shih, Robert E. Simons
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Patent number: 7952193Abstract: In one embodiment, the present invention is a method and apparatus for chip cooling. One embodiment of an inventive method for bonding a liquid metal to an interface surface (e.g., a surface of an integrated circuit chip or an opposing surface of a heat sink) includes applying an adhesive to the interface surface. A metal film is then bonded to the adhesive, thereby easily adapting the interface surface for bonding to the liquid metal.Type: GrantFiled: October 30, 2008Date of Patent: May 31, 2011Assignee: International Business Machines CorporationInventors: Bruce K. Furman, Yves C. Martin, Theodore G. Van Kessel
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Publication number: 20110095431Abstract: An electrical structure and method for forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure and a first solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. A second portion of the non-solder metallic core structure is thermo-compression bonded to the second electrically conductive pad.Type: ApplicationFiled: January 5, 2011Publication date: April 28, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bruce K. Furman, Jae-Woong Nah
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Patent number: 7868457Abstract: An electrical structure and method for forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure and a first solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. A second portion of the non-solder metallic core structure is thermo-compression bonded to the second electrically conductive pad.Type: GrantFiled: September 14, 2007Date of Patent: January 11, 2011Assignee: International Business Machines CorporationInventors: Bruce K. Furman, Jae-Woong Nah
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Patent number: 7863070Abstract: Apparatus and methods are provided for enabling wafer-scale encapsulation of microelectromechanical (MEM) devices (e.g., resonators, filters) to protect the MEMs from the ambient and to provide either a controlled ambient or a reduced pressure. In particular, methods for wafer-scale encapsulation of MEM devices are provided, which enable encapsulation of MEM devices under desired ambient conditions that are not determined by the deposition conditions of a sealing process in which MEM release via holes are sealed or pinched-off, and which prevent sealing material from being inadvertently deposited on the MEM device during the sealing process.Type: GrantFiled: March 17, 2008Date of Patent: January 4, 2011Assignee: International Business Machines CorporationInventors: Evan G. Colgan, Bruce K. Furman, Christopher V. Jahnes
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Patent number: 7855101Abstract: A structure for a semiconductor components is provided having a device layer sandwiched on both sides by other active, passive, and interconnecting components. A wafer-level layer transfer process is used to create this planar (2D) IC structure with added functional enhancements.Type: GrantFiled: August 20, 2009Date of Patent: December 21, 2010Assignee: International Business Machines CorporationInventors: Bruce K. Furman, Sampath Purushothaman, Muthumanickam Sankarapandian, Anna Topol