Patents by Inventor Bruce Lee Humphrey

Bruce Lee Humphrey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for making interconnect for low temperature chip attachment
    Patent number: 6340630
    Abstract: A method of forming interconnects on an electronic device that can be bonded to another electronic device at a low processing temperature can be carried out by depositing a first interconnect material on the electronic device forming protrusions and then depositing a second interconnect material to at least partially cover the protrusions, wherein the second interconnect material has a lower flow temperature than the first interconnect material. The method is carried out by flowing a molten solder into a mold having microcavities to fill the cavities and then allowed to solidify. The mold is then aligned with a silicon wafer containing chips deposited with high melting temperatures solder bumps such that each microcavity of the mold is aligned with each high melting temperature solder bump on the chip.
    Type: Grant
    Filed: March 28, 2000
    Date of Patent: January 22, 2002
    Assignee: International Business Machines Corporation
    Inventors: Daniel George Berger, Guy Paul Brouillette, David Hirsch Danovitch, Peter Alfred Gruber, Bruce Lee Humphrey, Michael Liehr, William Thomas Motsiff, Carlos Juan Sambucetti
  • Interconnect for low temperature chip attachment
    Patent number: 6127735
    Abstract: A method of forming interconnects on an electronic device that can be bonded to another electronic device at a low processing temperature can be carried out by depositing a first interconnect material on the electronic device forming protrusions and then depositing a second interconnect material to at least partially cover the protrusions, wherein the second interconnect material has a lower flow temperature than the first interconnect material. The method is carried out by flowing a molten solder into a mold having microcavities to fill the cavities and then allowed to solidify. The mold is then aligned with a silicon wafer containing chips deposited with high melting temperatures solder bumps such that each microcavity of the mold is aligned with each high melting temperature solder bump on the chip.
    Type: Grant
    Filed: September 25, 1996
    Date of Patent: October 3, 2000
    Assignee: International Business Machines Corporation
    Inventors: Daniel George Berger, Guy Paul Brouillette, David Hirsch Danovitch, Peter Alfred Gruber, Bruce Lee Humphrey, Michael Liehr, William Thomas Motsiff, Carlos Juan Sambucetti