Patents by Inventor Bruce M. Cepas

Bruce M. Cepas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7489198
    Abstract: A switched linear regulator includes a control device with a controlled current path and a control electrode. The current path is connected in series with a source of voltage and a load. An error signal generator compares the load voltage with a reference value to generate a degenerative error signal. The error signal is coupled to the control electrode with a voltage offset. An OFF control signal source includes a transistor which is connected to the control electrode to swamp or overpower the error signal, and render the controlled current path nonconductive. Thus, the same active control element both linearly regulates and provides an ON-OFF function. A speed-up transistor responds to the OFF signal to short the control electrode to a reference voltage to quickly discharge capacitance at the control electrode.
    Type: Grant
    Filed: April 26, 2007
    Date of Patent: February 10, 2009
    Assignee: Lockheed Martin Corporation
    Inventors: Bruce M. Cepas, Noel Delgado, Daniel H. McCauley, IV, Yan Zheng
  • Patent number: 7002800
    Abstract: An integrated thermal apparatus for improved electronic device performance has an energy storage device coupled with a thermoelectric management device for managing thermal energy generated by the electronic device. The thermoelectric management device can include a semiconductor thermoelectric device and phase change material, which can be integrated into a foam aluminum structure. The energy storage device can be a nanometallic device. The electrical load electrical efficiency is improved by co-locating it with thermoelectric management device directly on a composite substrate foundation to provide enhanced waste heat conversion to electrical energy. The apparatus manages the thermal and power issues at the substrate level in close proximity to the electrical load and incorporates the needed thermal mass into the support structure by way of a phase change material.
    Type: Grant
    Filed: March 28, 2002
    Date of Patent: February 21, 2006
    Assignee: Lockheed Martin Corporation
    Inventors: J. Michael Elias, Bruce M. Cepas, James A. Korn
  • Patent number: 6621702
    Abstract: An apparatus for absorbing thermal energy has an electronic component, a support structure for the electronic component having a first set of surfaces defining an interior volume containing a plurality of secondary surfaces, and a thermal energy absorbing material integrated within the interior volume, in contact with at least a portion of the secondary surfaces to form a composite structure. The thermal energy absorbing material is in operative thermal communication with the electronic component such that at least a portion of the thermal energy generated by the electronic component flows, via the support structure, into the thermal energy absorbing material. A method for controlling a temperature of an electronic component mounts an electronic component on a support structure in thermal communication with a thermal energy absorbing material integrated into an interior volume of the support structure.
    Type: Grant
    Filed: June 11, 2002
    Date of Patent: September 16, 2003
    Assignee: Lockheed Martin Corporation
    Inventors: J. Michael Elias, Bruce M. Cepas
  • Publication number: 20030142477
    Abstract: An apparatus for absorbing thermal energy has an electronic component, a support structure for the electronic component having a first set of surfaces defining an interior volume containing a plurality of secondary surfaces, and a thermal energy absorbing material integrated within the interior volume, in contact with at least a portion of the secondary surfaces to form a composite structure. The thermal energy absorbing material is in operative thermal communication with the electronic component such that at least a portion of the thermal energy generated by the electronic component flows, via the support structure, into the thermal energy absorbing material. A method for controlling a temperature of an electronic component mounts an electronic component on a support structure in thermal communication with a thermal energy absorbing material integrated into an interior volume of the support structure.
    Type: Application
    Filed: June 11, 2002
    Publication date: July 31, 2003
    Inventors: J. Michael Elias, Bruce M. Cepas
  • Publication number: 20030143958
    Abstract: An integrated thermal apparatus for improved electronic device performance has an energy storage device coupled with a thermoelectric management device for managing thermal energy generated by the electronic device. The thermoelectric management device can include a semiconductor thermoelectric device and phase change material, which can be integrated into a foam aluminum structure. The energy storage device can be a nanometallic device. The electrical load electrical efficiency is improved by co-locating it with thermoelectric management device directly on a composite substrate foundation to provide enhanced waste heat conversion to electrical energy. The apparatus manages the thermal and power issues at the substrate level in close proximity to the electrical load and incorporates the needed thermal mass into the support structure by way of a phase change material.
    Type: Application
    Filed: March 28, 2002
    Publication date: July 31, 2003
    Inventors: J. Michael Elias, Bruce M. Cepas, James A. Korn
  • Patent number: 6477035
    Abstract: A capacitive electrical energy storage structure is fabricated as a thin-film device comprising electrodes on opposite sides of a dielectric layer. In one approach, a high surface area metallic sponge can be incorporated into the structure. The energy storage structure can comprise either single or multiple layers of capacitors connected in series, parallel, or a combination of such arrangements. The multi-layer capacitor structure can be either applied directly to supporting structures of portable or transportable devices or can be fabricated as a film which is applied as a laminate to such structures. Further, a conformal energy storage structure can be produced which is shaped to fit in voids within devices, which voids would otherwise be little used or unused.
    Type: Grant
    Filed: October 10, 2001
    Date of Patent: November 5, 2002
    Assignee: Lockheed Martin Corporation
    Inventors: Bruce M Cepas, James A Korn, Jr.
  • Patent number: 5602554
    Abstract: A radar system which uses an active phased-array antenna achieves improved clutter improvement factor (CIF) by powering the various transmit-receive (TR) modules of the antenna with direct voltage (DC) derived from a plurality of phases of the power-line alternating current (AC). Each TR module receives power which originates with one phase of the source AC. The phases are selected so that the modulation of the radio-frequency (RF) signals by each TR module tends to cancel in the summed signal from the array antenna.
    Type: Grant
    Filed: August 8, 1995
    Date of Patent: February 11, 1997
    Assignee: Martin Marietta Corp.
    Inventors: Bruce M. Cepas, Wilbur Lew, Eric L. Holzman, John G. Ferrante