Abstract: A method of pumping an optical resonator includes directing light generated by a pumping light at the optical resonator, exciting a propagating surface state of the optical resonator at an interface of the optical resonator, and changing a propagating frequency of the light proximate the interface, where the changed frequency corresponds to a propagation frequency of the surface state. The optical resonator includes a photonic crystal and a material, where the interface is formed between the photonic crystal and the material.

Abstract: A method of pumping an optical resonator includes directing light generated by a pumping light at the optical resonator, exciting a propagating surface state of the optical resonator at an interface of the optical resonator, and changing a propagating frequency of the light proximate the interface, where the changed frequency corresponds to a propagation frequency of the surface state. The optical resonator includes a photonic crystal and a material, where the interface is formed between the photonic crystal and the material.

Abstract: A method of pumping an optical resonator includes directing light generated by a pumping light at the optical resonator, exciting a propagating surface state of the optical resonator at an interface of the optical resonator, and changing a propagating frequency of the light proximate the interface, where the changed frequency corresponds to a propagation frequency of the surface state. The optical resonator includes a photonic crystal and a material, where the interface is formed between the photonic crystal and the material.

Abstract: A method of pumping an optical resonator includes directing light generated by a pumping light at the optical resonator, exciting a propagating surface state of the optical resonator at an interface of the optical resonator, and changing a propagating frequency of the light proximate the interface, where the changed frequency corresponds to a propagation frequency of the surface state. The optical resonator includes a photonic crystal and a material, where the interface is formed between the photonic crystal and the material.

Abstract: A method of pumping an optical resonator includes directing light generated by a pumping light at the optical resonator, exciting a propagating surface state of the optical resonator at an interface of the optical resonator, and changing a propagating frequency of the light proximate the interface, where the changed frequency corresponds to a propagation frequency of the surface state. The optical resonator includes a photonic crystal and a material, where the interface is formed between the photonic crystal and the material.

Abstract: A method of pumping an optical resonator includes directing light generated by a pumping light at the optical resonator, exciting a propagating surface state of the optical resonator at an interface of the optical resonator, and changing a propagating frequency of the light proximate the interface, where the changed frequency corresponds to a propagation frequency of the surface state. The optical resonator includes a photonic crystal and a material, where the interface is formed between the photonic crystal and the material.

Abstract: A method of pumping an optical resonator includes directing light generated by a pumping light at the optical resonator, exciting a propagating surface state of the optical resonator at an interface of the optical resonator, and changing a propagating frequency of the light proximate the interface, where the changed frequency corresponds to a propagation frequency of the surface state. The optical resonator includes a photonic crystal and a material, where the interface is formed between the photonic crystal and the material.

Abstract: A method of pumping an optical resonator includes directing light generated by a pumping light at the optical resonator, exciting a propagating surface state of the optical resonator at an interface of the optical resonator, and changing a propagating frequency of the light proximate the interface, where the changed frequency corresponds to a propagation frequency of the surface state. The optical resonator includes a photonic crystal and a material, where the interface is formed between the photonic crystal and the material.

Abstract: Image sensors are provided having a plurality of photodetectors in a detector layer Optionally, an optically transparent substrate is provided for a rear-illuminated sensor architecture. The photodetectors may be arranged in three or more arrays. Typically, each array is contiguous and is associated with light of a different color and/or wavelength. In addition, the arrays may be coplanar, or, in the alternative, located at increasing distances from a light-receiving surface in an at least partially nonoverlapping manner. Also provided are image sensor packages.

Abstract: Elongated solder masses are formed by contacting the molten solder with the walls of holes in a dielectric layer overlying the front face of a chip element such as a wafer. The elongated solder masses have a relatively large aspect ratio, or ratio of height to maximum diameter, and thus provide a high reliability connection with a relatively small diameter compatible with closely spaced contacts on the chip.

Abstract: A method of making a plurality of sealed assemblies is provided which includes a) assembling a first element to a second element so that a bottom surface of the first element faces downwardly toward a front surface of the second element and a top surface of the first element faces upwardly away from the second element; and (b) forming ring seals surrounding regions of the front surface of the second element by introducing flowable material between the first element and the second element from the top surface of the first element through openings in the first element. A chip is provided which includes: (a) a body defining a front surface and one or more circuit elements on or within the body; (b) one or more bond pads exposed at the front surface in a bond pad region; and (c) a metallic ring exposed at the front surface, the ring substantially surrounding the bond pad region. Sealed chip assemblies are formed by sealing an array of the chips, e.g., in wafer form, to a cap element.

Abstract: An assembly structure and process for attaching integrated circuits to multichip modules and attaching the module to a printed circuit board. An epoxy loaded with diamond dust or boron nitride is used to attach the integrated circuit to the module. The dust material increases the thermal conductance of the epoxy for improved heat dissipation without substantially increasing the capacitance of interconnect routed underneath the epoxy. Reverse wedge wire bonding is also used to electrically connect the integrated circuit to the module allowing greater chip densities on the module surface. The chip/module assembly can then be mounted on a printed circuit board and the module leads wired directly to the board.