Abstract: A method of quantitating free (unbound) human C5 complement protein (C5) from a sample comprising: binding biotinylated anti-C5 capture antibody to strepavidin-coated particles; capturing the free (unbound) C5 in the sample; detecting the captured free C5; and quantitating the captured free C5 using laser-induced fluorescence detection; wherein the method is performed in a Gyros Bioaffy 200 CD in a Gyrolab xPlore or a Gyrolab XP instrument.

Abstract: Methods, apparatus, and computer programs are disclosed for buffer management in load balancing. In one embodiment, a method is disclosed to comprise providing a set of buffers by a storage of a load balancer to store packets to be distributed by the load balancer, and distributing the packets by the load balancer to a set of cores of a computer processor to be processed by the set of cores. The method further comprises responsive to buffer utilization in the storage over a first threshold, obtaining by circuitry of the load balancer, from top of a memory stack coupled to the storage, additional buffers to store the packets to be distributed and responsive to buffer utilization in the storage below a second threshold, returning by the circuitry of the load balancer, available buffers in the storage to the top of the memory stack.

Abstract: Disclosed herein are glasses that present several advantages over traditional glass compositions used in optical applications. The glasses disclosed herein have a low devitrification tendency and can be processed by melt quenching and formed into macroscopic components. The glasses have high glass thermal stability indices and are chemically durable. The glasses disclosed herein are transparent when heat treated in air or oxygen and have high refractive indices and low density, as well, making them suitable for optical applications.

Abstract: Thick (i.e., greater than two microns), fine-grained, low-stress tungsten MEMS structures are fabricated at low temperatures, particularly for so-called “MEMS last” fabrication processes (e.g., when MEMS structures are fabricated after electronic circuitry is fabricated). Means for very accurately etching structural details from the deposited tungsten layer and for strongly and stably anchoring the tungsten layer to an underlying substrate are disclosed. Also, means for removing a sacrificial layer underlying the mobile tungsten layer without damaging the tungsten or allowing it to be drawn down and stuck by surface tension is disclosed.

Abstract: Thick (i.e., greater than two microns), fine-grained, low-stress tungsten MEMS structures are fabricated at low temperatures, particularly for so-called “MEMS last” fabrication processes (e.g., when MEMS structures are fabricated after electronic circuitry is fabricated). Means for very accurately etching structural details from the deposited tungsten layer and for strongly and stably anchoring the tungsten layer to an underlying substrate are disclosed. Also, means for removing a sacrificial layer underlying the mobile tungsten layer without damaging the tungsten or allowing it to be drawn down and stuck by surface tension is disclosed.