Abstract: Vehicle mounted Radio Frequency Identification (RFID) systems and associated methods are provided. An example vehicle mounted RFID system is configured to operate an RFID system in a high-power mode. The example vehicle mounted RFID system is further configured to determine that an operating state of a vehicle switched from an active charging state to an inactive state. The example vehicle mounted RFID system is further configured to, in response to determine that the operating state of the vehicle switched from the active charging state to the inactive state, initialize a timer for a period of time. The example vehicle mounted RFID system is further configured to, in response to an elapse of the period of time, switch the RFID system to a low-power mode.

Abstract: Vehicle mounted Radio Frequency Identification (RFID) systems and associated methods are provided. An example vehicle mounted RFID system is configured to operate an RFID system in a high-power mode. The example vehicle mounted RFID system is further configured to determine that an operating state of a vehicle switched from an active charging state to an inactive state. The example vehicle mounted RFID system is further configured to, in response to determine that the operating state of the vehicle switched from the active charging state to the inactive state, initialize a timer for a period of time. The example vehicle mounted RFID system is further configured to, in response to an elapse of the period of time, switch the RFID system to a low-power mode.

Abstract: Provided are methods, systems, and apparatuses related to modular electronics platforms for mobile computing devices. One such apparatus may include a system on module (SOM) having a first surface that is configured to be coupled electrically to one or more chipsets. The apparatus may include a land grid array (LGA) disposed on a second surface of the SOM. The LGA may include one or more center anchor pads, one or more corner anchor pads, a digital signal array, one or more communications pads, and one or more ground pads. The various pads of the LGA may be configured to be coupled to one or more pads or pins disposed on a surface of a main logic board (MLB).

Abstract: Vehicle mounted Radio Frequency Identification (RFID) systems and associated methods are provided. An example vehicle mounted RFID system is configured to operate an RFID system in a high-power mode. The example vehicle mounted RFID system is further configured to determine that an operating state of a vehicle switched from an active charging state to an inactive state. The example vehicle mounted RFID system is further configured to, in response to determine that the operating state of the vehicle switched from the active charging state to the inactive state, initialize a timer for a period of time. The example vehicle mounted RFID system is further configured to, in response to an elapse of the period of time, switch the RFID system to a low-power mode.

Abstract: Vehicle mounted Radio Frequency Identification (RFID) systems and associated methods are provided. An example vehicle mounted RFID system is configured to operate an RFID system in a high-power mode. The example vehicle mounted RFID system is further configured to determine that an operating state of a vehicle switched from an active charging state to an inactive state. The example vehicle mounted RFID system is further configured to, in response to determine that the operating state of the vehicle switched from the active charging state to the inactive state, initialize a timer for a period of time. The example vehicle mounted RFID system is further configured to, in response to an elapse of the period of time, switch the RFID system to a low-power mode.

Abstract: Vehicle mounted Radio Frequency Identification (RFID) systems and associated methods are provided. An example vehicle mounted RFID system is configured to operate an RFID system in a high-power mode. The example vehicle mounted RFID system is further configured to determine that an operating state of a vehicle switched from an active charging state to an inactive state. The example vehicle mounted RFID system is further configured to, in response to determine that the operating state of the vehicle switched from the active charging state to the inactive state, initialize a timer for a period of time. The example vehicle mounted RFID system is further configured to, in response to an elapse of the period of time, switch the RFID system to a low-power mode.

Abstract: Vehicle mounted Radio Frequency Identification (RFID) systems and associated methods are provided. An example vehicle mounted RFID system is configured to operate an RFID system in a high-power mode. The example vehicle mounted RFID system is further configured to determine that an operating state of a vehicle switched from an active charging state to an inactive state. The example vehicle mounted RFID system is further configured to, in response to determine that the operating state of the vehicle switched from the active charging state to the inactive state, initialize a timer for a period of time. The example vehicle mounted RFID system is further configured to, in response to an elapse of the period of time, switch the RFID system to a low-power mode.

Abstract: Provided are methods, systems, and apparatuses related to modular electronics platforms for mobile computing devices. One such apparatus may include a system on module (SOM) having a first surface that is configured to be coupled electrically to one or more chipsets. The apparatus may include a land grid array (LGA) disposed on a second surface of the SOM. The LGA may include one or more center anchor pads, one or more corner anchor pads, a digital signal array, one or more communications pads, and one or more ground pads. The various pads of the LGA may be configured to be coupled to one or more pads or pins disposed on a surface of a main logic board (MLB).

Abstract: Provided are methods, systems, and apparatuses related to modular electronics platforms for mobile computing devices. One such apparatus may include a system on module (SOM) having a first surface that is configured to be coupled electrically to one or more chipsets. The apparatus may include a land grid array (LGA) disposed on a second surface of the SOM. The LGA may include one or more center anchor pads, one or more corner anchor pads, a digital signal array, one or more communications pads, and one or more ground pads. The various pads of the LGA may be configured to be coupled to one or more pads or pins disposed on a surface of a main logic board (MLB).

Abstract: Provided are methods, systems, and apparatuses related to modular electronics platforms for mobile computing devices. One such apparatus may include a system on module (SOM) having a first surface that is configured to be coupled electrically to one or more chipsets. The apparatus may include a land grid array (LGA) disposed on a second surface of the SOM. The LGA may include one or more center anchor pads, one or more corner anchor pads, a digital signal array, one or more communications pads, and one or more ground pads. The various pads of the LGA may be configured to be coupled to one or more pads or pins disposed on a surface of a main logic board (MLB).

Abstract: Provided are methods, systems, and apparatuses related to modular electronics platforms for mobile computing devices. One such apparatus may include a system on module (SOM) having a first surface that is configured to be coupled electrically to one or more chipsets. The apparatus may include a land grid array (LGA) disposed on a second surface of the SOM. The LGA may include one or more center anchor pads, one or more corner anchor pads, a digital signal array, one or more communications pads, and one or more ground pads. The various pads of the LGA may be configured to be coupled to one or more pads or pins disposed on a surface of a main logic board (MLB).

Abstract: Provided are methods, systems, and apparatuses related to modular electronics platforms for mobile computing devices. One such apparatus may include a system on module (SOM) having a first surface that is configured to be coupled electrically to one or more chipsets. The apparatus may include a land grid array (LGA) disposed on a second surface of the SOM. The LGA may include one or more center anchor pads, one or more corner anchor pads, a digital signal array, one or more communications pads, and one or more ground pads. The various pads of the LGA may be configured to be coupled to one or more pads or pins disposed on a surface of a main logic board (MLB).

Abstract: A mobile printer comprising a printer body and a printer door is provided. The printer body typically has a recessed area that is sized to receive a media roll. The media roll typically has a void interior portion that is sized to receive one or more batteries that provide power to the mobile printer. Further, the printer door is operatively coupled to the printer body. When in an open position, the printer door typically allows for placement of a media roll from a side of the mobile printer into the recessed area. When closed, however, the media roll is typically retained in place relative to the printer body and the media from the media roll is captured for printing.

Abstract: A mobile printer comprising a printer body and a printer door is provided. The printer body typically has a recessed area that is sized to receive a media roll. The media roll typically has a void interior portion that is sized to receive one or more batteries that provide power to the mobile printer. Further, the printer door is operatively coupled to the printer body. When in an open position, the printer door typically allows for placement of a media roll from a side of the mobile printer into the recessed area. When closed, however, the media roll is typically retained in place relative to the printer body and the media from the media roll is captured for printing.

Abstract: A mobile printer comprising a printer body and a printer door is provided. The printer body has a recessed area that is sized to receive a media roll. The media roll has a void interior portion that is sized to receive one or more batteries that provide power to the mobile printer. Further, the printer door is operatively coupled to the printer body. When in an open position, the printer door allows for placement of a media roll from a side of the mobile printer into the recessed area. When closed, however, the media roll is retained in place relative to the printer body and the media from the media roll is captured for printing.

Abstract: A mobile printer comprising a printer body and a printer door is provided. The printer body has a recessed area that is sized to receive a media roll. The media roll has a void interior portion that is sized to receive one or more batteries that provide power to the mobile printer. Further, the printer door is operatively coupled to the printer body. When in an open position, the printer door allows for placement of a media roll from a side of the mobile printer into the recessed area. When closed, however, the media roll is retained in place relative to the printer body and the media from the media roll is captured for printing.

Abstract: A label printer embedded RFID tag reader/writer and the media roll with a rewritable RFID tag affixed to the media are used to keep a running tally of the number of remaining labels on the roll and record the tally onto the RFID tag. The printer “odometer” keeps track of the number of labels remaining on a media roll or for receipt tape, the remaining length of the tape. The printer sends a signal to the rewritable RFID tag on the printer media with accurate information about the remaining media.

Abstract: A memory has an ECC-enabled mode and an ECC-disabled mode in which the portion of the memory dedicated to use as storing ECC in the ECC-enabled mode is used for storing general purpose information (data) in the ECC-disabled mode. This is achieved in a non-volatile memory (NVM) by having the data and the portion of the memory with the corresponding ECC on the same word line. This is particularly important in an NVM because of complication relating to erase. In the ECC-enabled mode the ECC and corresponding data should be erased, programmed, and read together in order to avoid a significant layout and performance penalty. This is best achieved by having the ECC and the data on the same word line.

Abstract: A data processing system (10) has an embedded non-volatile memory (22) that is programmed and erased by use of a high voltage provided by a charge pump (78). In order to prevent the non-volatile memory (22) from being inadvertently programmed or erased during low power supply voltage conditions, the charge pump (78) is disabled and discharged when the power supply voltage drops below a predetermined value. This is accomplished by enabling a low voltage detect circuit (110) in response to a program or erase operation being initiated. A control register (76) will provide a high voltage enable signal to the charge pump (78) only when a power supply valid signal is received. In another embodiment, the low voltage detect circuit (110) may be enabled by another condition to protect the data processing system (10) from an authorized access.

Abstract: A single memory array (10) has an isolation circuit for isolating segments of a same bit line (Seg1 BL0, Seg2 BL0) from each other. The isolation circuit (16) permits memory cells located in one segment (12) of an array to be read while memory cells of another segment (14) of the array are being erased. In one example, the isolation circuit (16) electrically couples the segments during a read or program of memory cells located on the second segment (Seg2 BL0). Program information stored in the single memory array may always be accessed while a portion of the same array is erased. Dynamic variation of the size of the isolated bit line segment occurs when multiple isolation circuits are used to create more than two array segments.