Abstract: An assembly for coupling thermally a thermoelectric generator (TEG) to an exhaust manifold includes a first heat-exchanger, a first dielectric-layer, a TEG, and a direct-bond-copper-arrangement (DBC). The first dielectric-layer overlies a portion of the outer surface of the first heat-exchanger. The first dielectric-layer is formed by firing a thick-film dielectric material onto the stainless steel of the first heat-exchanger. The TEG defines a first contact suitable to be coupled thermally and electrically to the first conductor-layer. The DBC is interposed between the first dielectric-layer and the first contact of the TEG. The DBC is formed by an adhesion-layer formed of high-adhesion-copper-thick-film in contact with the first dielectric-layer, a bond-layer formed of copper-thick-film that overlies and is in contact with the adhesion-layer opposite the first-dielectric-layer, and a copper-foil-layer that overlies and is in contact with the bond-layer opposite the adhesion-layer.

Abstract: An apparatus suitable for controlling vegetation which apparatus comprises a hot-liquid reservoir (28), release means (38) connected to the hot-liquid reservoir (28) and at least one nozzle (74), for applying a stream of foam that contains steam, connected to the reservoir through the release means. The apparatus includes a heating means (34) to keep the liquid hot so the pressure is above atmospheric pressure. The liquid may be pumped by a pump (36) through the hot-water reservoir (28), the water being heated on demand by heaters (34) within the reservoir (28). The apparatus is either propelled by or mounted on a vehicle; and during use of the apparatus to control vegetation the vehicle provides power (24) to the heating means.

Abstract: A system for separating carbon dioxide gas from internal combustion engine exhaust and an electricity generating heat exchanger for the system. The system includes a scrubber tank containing a carbon dioxide absorbent fluid and configured to bubble exhaust gas from the heat exchanger through the carbon dioxide absorbent fluid, whereby carbon dioxide gas is absorbed by the carbon dioxide absorbent fluid. A carbon dioxide storage means stores the carbon dioxide released in a heat exchanger. The heat exchanger cools the exhaust gas emitted by the internal combustion engine, and includes a thermal electric generator (TEG) configured to couple thermally the exhaust gas chamber to the absorber fluid chamber in a manner effective to heat the CO2 absorbent fluid by heat from the engine exhaust to release CO2 gas from the CO2 absorbent fluid and generate electricity in response to a temperature difference therebetween.

Abstract: An assembly for coupling thermally a thermoelectric generator (TEG) to an exhaust manifold of an internal combustion engine. The exhaust manifold forms a first heat exchanger configured to couple thermally heat from exhaust gas to an outer surface of the first heat exchanger. The outer surface is preferably formed of stainless steel. A first dielectric layer is formed by firing a thick-film dielectric material onto the stainless steel of the first heat exchanger. A first conductor layer is formed by firing a conductive thick-film onto the first dielectric layer. A first paste layer of silver (Ag) based sintering paste is interposed between the first conductor layer and a first contact of the TEG. The first contact is sintered to the first conductor layer when the assembly is suitably arranged and suitably heated.

Abstract: An assembly for coupling thermally a thermoelectric generator (TEG) to an exhaust manifold of an internal combustion engine. The assembly includes a first heat exchanger configured to guide exhaust gas of an internal combustion engine past an opening defined by the first heat exchanger, and a heat sink configured to couple thermally the TEG to the exhaust gas and fluidicly seal the opening. The assembly is configured so the heat sink is directly exposed to the exhaust gas so that heat is efficiently transferred from the exhaust gas to the TEG.

Abstract: A carbon dioxide storage means stores the carbon dioxide released in a heat exchanger. The heat exchanger cools the exhaust gas emitted by the internal combustion engine, and includes a thermal electric generator (TEG) configured to couple thermally the exhaust gas chamber to the absorber fluid chamber in a manner effective to heat the CO2 absorbent fluid by heat from the engine exhaust to release CO2 gas from the CO2 absorbent fluid and generate electricity in response to a temperature difference therebetween. The CO2 absorbent fluid is one of: a) an aliphatic di-functional nitrile (e.g. pimelonitrile); and b) an oligomeric poly-acrylonitrile (PAN).

Abstract: A system for separating and storing carbon dioxide (CO2) in exhaust produced by an internal combustion engine. The system uses a scrubber tank containing a carbon dioxide absorbent fluid to capture CO2 in the exhaust. The system also includes a carbon dioxide storage means configured to temporarily store the captured CO2, and a CO2 recovery facility to refine the captured CO2 for future use or prepare the CO2 for permanent storage. The system is intended for installation on vehicles such as automobiles to reduce the amount of CO2 emitted by automobiles into the environment, but could also be used for other applications such as stationary power generators.

Abstract: A thermal-protection apparatus disposed in a vehicle cabin or storage compartment includes a housing enveloping a chamber in which a thermally-sensitive consumer electronic device is received, a thermoelectric module mounted in a wall of the housing, and a remote electronic controller and power source coupled to the housing via an electrical cable for activating the thermoelectric module, and optionally the consumer electronic device, in a manner to prevent the temperature in the chamber from exceeding a prescribed maximum operating temperature of the consumer electronic device or falling below a prescribed minimum operating temperature of the consumer electronic device.

Abstract: Detecting a discontinuity or impedance irregularity in an active line, a neutral return line and/or an earth return path of a power distribution network is disclosed. In one aspect, the apparatus is configured to measure a change in voltage and/or current associated with a deliberate switching of a known impedance and/or a naturally occurring random switching of an impedance in the electrical network wherein the change in voltage and/or current flow results from a discontinuity or impedance irregularity in the active line, neutral line and/or earth return path. The apparatus includes an algorithm for identifying discontinuity or impedance irregularity in the presence of allowable variation in voltage and/or current that may mimic or hide a discontinuity or impedance irregularity in the active line, neutral return line and/or earth return path including a reverse current flow through the earth return path.

Abstract: A thermal-protection apparatus disposed in a vehicle cabin or storage compartment includes a housing enveloping a chamber in which a thermally-sensitive consumer electronic device is received, a thermoelectric module mounted in a wall of the housing, and a remote electronic controller and power source coupled to the housing via an electrical cable for activating the thermoelectric module, and optionally the consumer electronic device, in a manner to prevent the temperature in the chamber from exceeding a prescribed maximum operating temperature of the consumer electronic device or falling below a prescribed minimum operating temperature of the consumer electronic device.

Abstract: A transparent bevel apparatus overlays marginal portions of juxtaposed display devices of a segmented display panel to obscure the visual gap between the display devices. The bevel apparatus at least partially overlaps only marginal pixels of the adjacent display devices, so that light from a given display device that passes through the bevel apparatus is bent toward from the respective display device at an angle with respect to the remainder of the emitted light. Consequently, light emitted from the marginal portions of the juxtaposed display devices is seen by the viewer in the place where the visual gap would otherwise be seen. The bevel apparatus may be constructed in the form of a sheet that overlays an entire display device, or all or a portion of the entire display panel, or a narrow strip that is aligned with the seams and affixed to juxtaposed faces of the display devices.

Abstract: A method is disclosed for detecting a discontinuity or irregularity in a supply line of an electrical power distribution network including a neutral return line and an earth return line. The method includes measuring a property associated with the supply line wherein the property is different when the network includes the neutral return line compared to when the network does not include the neutral return line. The method also includes comparing a result of the measuring with a reference to provide an indication of the discontinuity or irregularity. The property may include a complex impedance associated with the neutral return line or earth return line and/or ambient electrical noise present on the supply line. An apparatus for detecting a discontinuity or irregularity in a supply line of an electrical power distribution network is also disclosed.

Abstract: A stacked array of channeled semiconductor chips defining a power electronic circuit is mounted in a sealed container provided with inlet and outlet passages for liquid coolant. Leadframe terminals supported by the container engage selected terminals of the semiconductor chips and form leads for mounting the container on a circuit board having electrical and fluid interconnects.

Abstract: A heat-dissipating component including a heat-generating device such as a power semiconductor chip and a mounting structure is provided with coolant channels having a stair-stepped internal geometry that enhances cooling performance with both single-phase and two-phase cooling modes without unduly restricting coolant flow or significantly increasing manufacturing cost. The stair-stepped geometry enhances both single-phase and two-phase cooling modes by increasing the surface area of the channels, and further enhances the two-phase cooling mode by providing numerous high-quality bubble nucleation sites along the length of the channels. The stair-stepped channels are formed in the heat generating device and/or the mounting structure, and the stepped sidewalls may extend toward or away from the center of the channel.

Abstract: A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The packages are individually identical, and selectively oriented prior to stacking in order to form the desired circuit connections and laterally stagger the package leads.

Abstract: A circuit assembly containing a surface mount (SM) IC package wire bonded to a substrate and configured to conduct heat from the package into a heat sink through a heat-conducting member instead of the substrate. The package contains an IC device with input/output pads on a surface thereof that are connected with leads to conductors on the substrate. The heat sink is located adjacent the package so as not to be separated from the package by the substrate. The heat-conducting member is positioned adjacent the surface of the device opposite its input/output pads, and is bonded to the device and heat sink to provide a heat path between the package and heat sink that does not pass through the substrate.

Abstract: An electronic assembly is provided having a thermal cooling fluid, such as a liquid, for cooling an electronic device within a sealed compartment. The assembly includes a housing generally defining a sealed fluid compartment, an electronic device disposed within the housing and a cooling liquid for cooling the electronic device. The assembly includes inlet and outlet ports in fluid communication with the sealed fluid compartment for allowing the cooling liquid to pass through the compartment to cool the electronic device. Fluid flow channels are formed in thermal communication with the electronic device within the housing. The fluid channels include channels that allow liquid to flow in thermal communication with the electronic device to cool the device.

Abstract: A power semiconductor device package utilizes integral fluid conducting micro-channels, one or more inlet ports for supplying liquid coolant to the micro-channels, and one or more outlet ports for exhausting coolant that has passed through the micro-channels. The semiconductor device is mounted on a single or multi-layer circuit board having electrical and fluid interconnect features that mate with the electrical terminals and inlet and outlet ports of the device to define a self-contained and self-sealed micro-channel heat exchanger.

Abstract: The present invention provides a high performance polymer-base material capable of dissipating transient thermal energy generated by an electronic module, such as a heat-generating power device. The methods of the present invention involve adding a suitable thinner to reduce the viscosity and increase the volume of a polymer-base matrix material so that a large amount of thermal absorbing particles may be added. The final cured product may have a filler content of more than 80 weight %. Further, the present invention provides a new and reduced cost formulation of a polymer-base thermal transient suppression material containing organic wax particles.

Abstract: A low cost transistor package is provided for high power applications. The package provides high thermal conductivity and dissipation for a silicon transistor die, high current carrying capability and isolation, and high power and thermal cycle life performance and reliability. A dielectric layer is fixed to a silicon transistor die, for coupling to a heat conducting buffer and attachment to a substrate. The dielectric layer is fixed to the die by growing the dielectric layer, depositing the dielectric layer, or applying the dielectric layer using a plasma spray. In an aspect, a conductive layer is formed to the silicon transistor die by a thermal or kinetic spray process, and the dielectric layer is applied to the conductive layer. The dielectric layer may also be established either before or after the transistor fabrication. Electrical and thermal interconnects are advantageously positioned from opposite sides of the silicon transistor die.