Patents by Inventor Bruce Polson

Bruce Polson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for improved die release of a semiconductor device from a wafer
    Patent number: 6544898
    Abstract: A microelectromechanical (MEMS) device and a method of fabricating a MEMS device are provided. The method of fabricating the MEMS device includes the steps of: etching a die release trench in a primary handle layer of a wafer having the handle layer, an etch-stop layer disposed on the primary handle layer, and a device layer disposed on the etch-stop layer; patterning a release trench in the device layer that is aligned with the release trench in the primary handle layer; temporarily attaching an additional handle layer to the primary handle layer; etching the device layer to define a structure in the device layer; removing the etch-stop layer; and removing the additional handle layer to release the die.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: April 8, 2003
    Assignee: ADC Telecommunications, Inc.
    Inventors: Bruce Polson, Nan Zhang, Howard P. Wilson
  • METHOD FOR IMPROVED DIE RELEASE OF A SEMICONDUCTOR DEVICE FROM A WAFER
    Publication number: 20020197873
    Abstract: A microelectromechanical (MEMS) device and a method of fabricating a MEMS device are provided. The method of fabricating the MEMS device includes the steps of: etching a die release trench in a primary handle layer of a wafer having the handle layer, an etch-stop layer disposed on the primary handle layer, and a device layer disposed on the etch-stop layer; patterning a release trench in the device layer that is aligned with the release trench in the primary handle layer; temporarily attaching an additional handle layer to the primary handle layer; etching the device layer to define a structure in the device layer; removing the etch-stop layer; and removing the additional handle layer to release the die.
    Type: Application
    Filed: June 25, 2001
    Publication date: December 26, 2002
    Inventors: Bruce Polson, Nan Zhang, Howard P. Wilson