Abstract: An arrangement includes a chassis, and a first mating component disposed inside of the chassis. A second mating component is provided. The first mating component is removably connected to the second mating component. A sliding tab is connected to the chassis and is slidable in a linear direction from a first position to a second position. When the sliding tab is in the first position, the first mating component is free to be removed from the second mating component. When the sliding tab is in the second position, the first mating component is secured to the second mating component to prevent the removal of the first mating component from the second mating component.

Abstract: A spring carrier assembly to attenuate EMI, including an elongated multileaf conductive spring and an elongated carrier. The elongated multileaf conductive spring has a free edge and curved edge. The elongated carrier has a first edge section encompassing the curved edge and a second edge section encompassing the free edge, wherein portions of the conductive spring are exposed and may contact electronic modules in use. The carrier includes a first pivot member formed at a first end of the first edge section of the carrier and second pivot member formed a second end of the first edge section. Spring carriers assemblies may be placed within a housing for receiving electronic modules. Placement of a number of spring carrier assemblies within the housing forms one or more arrays of spring carrier assemblies. An electronic module may be placed within the housing between two arrays of the spring carrier assembly.

Abstract: An apparatus that provides a cooling system in which electronic components are serially configured in the air flow path and tilted down to form a "V" formation when viewed from the side. An air moving device draws air from an inlet, serially past first and second components and exhausts air through an outlet. This formation increases the inlet air opening, increases the area to turn the air in between the components, and increases the size of the plenum between the rear components and the air moving device, all without increasing the size of the electronic device. The larger area reduces the resistance of the air flow cooling path by reducing the number of turns and velocity changes of the air flow, which allows the air moving device to be smaller, use less power, and generate less noise.