Patents by Inventor Bruce Pickelsimer

Bruce Pickelsimer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sacrificial films to provide structural integrity to critical dimension structures
    Publication number: 20020142594
    Abstract: Various methods of processing a circuit structure with a protective coating are provided. In one aspect, a method of processing a semiconductor substrate is provided that includes patterning a structure on the substrate and forming a protective coating on the patterned structure while leaving other surfaces on the substrate exposed. The exposed surfaces are cleaned by immersing the substrate in a liquid and subjecting the exposed surfaces to sonic pulses whereby the protective coating increases the strength of the patterned structure to reduce the potential for structural failure induced by the sonic pulses. The protective coating is then removed.
    Type: Application
    Filed: March 28, 2001
    Publication date: October 3, 2002
    Applicant: Advanced Micro Devices, Inc.
    Inventors: Terri A. Couteau, Michael J. Satterfield, Laura A. Pressley, Bruce Pickelsimer
  • Method of fabricating topside structure of a semiconductor device
    Patent number: 5989938
    Abstract: The present method and apparatus provides a thin layer of oxynitride over a device including a patterned metal layer, application of a planarizing SOG layer over the thin oxynitride layer, removal of thin portions of the SOG layer by etching to expose portions of the thin oxynitride layer, and application of a thick oxynitride layer to form a strong bond with the thin oxynitride layer. A thin nitride layer, transparent to UV light, may then be applied to the resulting structure prior to application of plastic packaging material.
    Type: Grant
    Filed: September 4, 1997
    Date of Patent: November 23, 1999
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Hsingya Arthur Wang, Bandali B. Mohamed, Shyam Garg, Bruce Pickelsimer
  • Method of fabricating topside structure of a semiconductor device
    Patent number: 5728453
    Abstract: The present method and apparatus provides a thin layer of oxynitride over a device including a patterned metal layer, application of a planarizing SOG layer over the thin oxynitride layer, removal of thin portions of the SOG layer by etching to expose portions of the thin oxynitride layer, and application of a thick oxynitride layer to form a strong bond with the thin oxynitride layer. A thin nitride layer, transparent to UV light, may then be applied to the resulting structure prior to application of plastic packaging material.
    Type: Grant
    Filed: December 28, 1995
    Date of Patent: March 17, 1998
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Hsingya Arthur Wang, Mohamed B. Bandali, Shyam Garg, Bruce Pickelsimer