Patents by Inventor Bruce Reid

Bruce Reid has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7927927
    Abstract: A semiconductor package substrate (11) has an array of package sites (13, 14, 16, and 21) that are substantially identical. The entire array of package sites (13, 14, 16, and 21) is covered by an encapsulant (19). The individual package sites (13, 14, 16, and 21) are singulated by sawing through the encapsulant (19) and the underlying semiconductor package substrate (11).
    Type: Grant
    Filed: August 13, 2001
    Date of Patent: April 19, 2011
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Son Ky Quan, Samuel L. Coffman, Bruce Reid, Keith E. Nelson, Deborah A. Hagen
  • Publication number: 20020174697
    Abstract: The present invention comprises a dry composition of a plant and/or soil amendment and a suspending agent, a liquid composition created therefrom and a method of making and using the same.
    Type: Application
    Filed: February 16, 2001
    Publication date: November 28, 2002
    Inventors: Bruce Reid, Michael Karr
  • Publication number: 20020053452
    Abstract: A semiconductor package substrate (10) has an array of package sites (13,14,16,21,22, and 23) that are substantially identical. The entire array of package sites (13,14,16,21,22, and 23) is covered by an encapsulant (19). The individual package sites (13,14,16,21,22, and 23) are singulated by sawing through the encapsulant (19) and the underlying semiconductor package substrate (10).
    Type: Application
    Filed: August 13, 2001
    Publication date: May 9, 2002
    Inventors: Son Ky Quan, Samuel L. Coffman, Bruce Reid, Keith E. Nelson, Deborah A. Hagen
  • Patent number: 6174046
    Abstract: The contact pads of a print cartridge are formed on a flexible tape. Each of the uniformly spaced contact pads is preferably a square separated from an adjacent square by a minimum distance to provide each contact pad with a maximum area. Conductive traces run along the flexible tape and between the contact pads to allow for a minimum separation between contact pads, thus allowing the contact pads to be made relatively large. This improves the reliability of the interconnection between the pads and the printer electrodes.
    Type: Grant
    Filed: January 6, 1998
    Date of Patent: January 16, 2001
    Assignee: Hewlett-Packard Company
    Inventors: W. Bruce Reid, Mindy A. Hamlin, Arthur K. Wilson, Donald G. Harris, Majid Azmoon
  • Patent number: 5851149
    Abstract: The Distributed Gaming System provides a user with remote location gaming, for example from within a hotel room. Using the room's television and a remote control, the user, such as a hotel guest, is able to play games similar to those available on a Video Lottery Terminal. The games are displayed on a TV through the use of a TV set-top box. The set top box connects the TV to a network of computer systems through which the Gaming System is distributed and managed. Game access is obtained using a payment swipe device. A special feature of system is the progressive jackpots that are available to game players; these jackpots are at the hotel, jurisdiction, and global levels.
    Type: Grant
    Filed: August 4, 1995
    Date of Patent: December 22, 1998
    Assignee: Tech Link International Entertainment Ltd.
    Inventors: John Xidos, Ross MacDougall, David Carrigan, Gary Hammond, Pamela Little, Bruce Reid
  • Patent number: 5776798
    Abstract: A semiconductor package substrate (10) has an array of package sites (13,14,16,21,22, and 23) that are substantially identical. The entire array of package sites (13,14,16,21,22, and 23) is covered by an encapsulant (19). The individual package sites (13,14,16,21,22, and 23) are singulated by sawing through the encapsulant (19) and the underlying semiconductor package substrate (10).
    Type: Grant
    Filed: September 4, 1996
    Date of Patent: July 7, 1998
    Assignee: Motorola, Inc.
    Inventors: Son Ky Quan, Samuel L. Coffman, Bruce Reid, Keith E. Nelson, Deborah A. Hagen
  • Patent number: 5766983
    Abstract: A process for manufacturing a tape automated bonding circuit with interior sprocket holes including: a substrate; at least one conductor deposited on the substrate; a functional area on the substrate defined by a polygon surrounding the conductor with all sides of the polygon adjacent to a segment of the conductor and with interior angles of the polygon between the sides of the polygon greater or equal to ninety degrees and having at least one sprocket hole within the functional area on the substrate. The sprocket hole is used to engage and drive the tape automated bonding circuit through processing steps. In a specific embodiment the functional area on the substrate has a first set of two sprocket holes within the functional area, which are used to engage and drive the tape automated bonding circuit through processing steps.
    Type: Grant
    Filed: August 8, 1997
    Date of Patent: June 16, 1998
    Assignee: Hewlett-Packard Company
    Inventor: W. Bruce Reid
  • Patent number: 5706040
    Abstract: The contact pads of a print cartridge are formed on a flexible tape. Each of the uniformly spaced contact pads is preferably a square separated from an adjacent square by a minimum distance to provide each contact pad with a maximum area. The contact pads are arranged on the flexible tape only along the side portions of the plastic print cartridge body, where body is generally flat, to avoid the pads being located in the sunken middle portion of the body, where the sinking occurs during the injection molding process used to form the body. This improves the reliability of the interconnection between the pads and the printer electrodes.
    Type: Grant
    Filed: January 17, 1995
    Date of Patent: January 6, 1998
    Assignee: Hewlett-Packard Company
    Inventors: W. Bruce Reid, Mindy A. Hamlin, Arthur K. Wilson
  • Patent number: 5568171
    Abstract: An inkjet printhead includes a compact substrate having transmission circuitry such as actuation signal lines and address circuitry and ground lines in connection with resistors in a plurality of vaporization chambers on the substrate, with a minimal number of interconnect junctions located at both ends of the substrate. A print cartridge holding the inkjet printhead has a flexible circuit member with conductive traces permanently bonded at one end to the interconnect junctions and terminating at the other end at cartridge interconnect pads.
    Type: Grant
    Filed: October 6, 1994
    Date of Patent: October 22, 1996
    Assignee: Hewlett-Packard Company
    Inventors: Brian J. Keefe, Winthrop D. Childers, Steven W. Steinfield, W. Bruce Reid
  • Patent number: 5414454
    Abstract: Slits are cut in a nozzle tape and aligned with encapsulant beads on a printhead. The slits mechanically decouple portions of the tape stuck to the beads from a central portion of the tape stuck to a nozzle plate, and thereby prevent lifting of the tape off the nozzle plate in the event that the tape subsequently contracts. A method of attaching the tape to the printhead aligns blades with the beads on the printhead, so that the blades cut slits in the tape that are aligned with the beads. The tape is then adhesively secured to the printhead, preserving the alignment.
    Type: Grant
    Filed: April 30, 1993
    Date of Patent: May 9, 1995
    Assignee: Hewlett-Packard Company
    Inventor: W. Bruce Reid
  • Patent number: 5359353
    Abstract: An ink jet pen supply cartridge having a spring biased ink bag with a visual indication of remaining ink quantity. The spring-bag reservoir tends to collapse laterally as the ink supply decreases due to differential pressure exerted thereto. The spring-bag is contained in a rigid cartridge and a pair of flexible tape members are cemented or welded, one to each side of the spring-bag, and extend generally parallel toward a narrow end surface of the cartridge at which they overlap and can be viewed through a window. The overlapping relationship of the tape members provide ink quantity indicia which change as the spring-bag collapse draws them past each other.
    Type: Grant
    Filed: June 19, 1991
    Date of Patent: October 25, 1994
    Assignee: Hewlett-Packard Company
    Inventors: David S. Hunt, W. Bruce Reid