Patents by Inventor Bruce Rowenhorst

Bruce Rowenhorst has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11631808
    Abstract: A system may include an array of interconnected memristors. Each memristor may include a first electrode, a second electrode, and a memristor material positioned between the first electrode and the second electrode. The system may further include a controller communicatively coupled to the array of interconnected memristors. The controller may be configured to tune the array of interconnected memristors.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: April 18, 2023
    Assignee: Rockwell Collins, Inc.
    Inventors: Kyle B. Snyder, Nathaniel P. Wyckoff, Brandon C. Hamilton, Bruce Rowenhorst, Steven J. Wiebers
  • Patent number: 11469373
    Abstract: A system may include a first conductive plate configured at least to receive an input signal. The system may include a second conductive plate configured at least to output an output signal. The system may further include a memristor material positioned between the first conductive plate and the second conductive plate.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: October 11, 2022
    Assignee: Rockwell Collins, Inc.
    Inventors: Kyle B. Snyder, Nathaniel P. Wyckoff, Brandon C. Hamilton, Bruce Rowenhorst, Steven J. Wiebers
  • Patent number: 11462267
    Abstract: A system may include a multi-lead memristor. The multi-lead memristor may include a first lead, a second lead, a third lead, a first memristor material, and a second memristor material. The second lead may be positioned between the first lead and the third lead. The first memristor material may be positioned between the first lead and the second lead. The second memristor material may be positioned between the second lead and the third lead.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: October 4, 2022
    Assignee: Rockwell Collins, Inc.
    Inventors: Kyle B. Snyder, Nathaniel P. Wyckoff, Brandon C. Hamilton, Bruce Rowenhorst, Steven J. Wiebers
  • Patent number: 11456418
    Abstract: A system may include a first conductive plate configured at least to receive an input signal and a second conductive plate configured at least to output an output signal. The system may further include a first memristor material positioned between the first conductive plate and the second conductive plate. The system may further include a second memristor material positioned between the first conductive plate and the second conductive plate. The first memristor material and the second memristor material may be in parallel electrically. The first memristor material may be different from the second memristor material.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: September 27, 2022
    Assignee: Rockwell Collins, Inc.
    Inventors: Kyle B. Snyder, Nathaniel P. Wyckoff, Brandon C. Hamilton, Bruce Rowenhorst, Steven J. Wiebers
  • Publication number: 20220180924
    Abstract: A system may include a multi-lead memristor. The multi-lead memristor may include a first lead, a second lead, a third lead, a first memristor material, and a second memristor material. The second lead may be positioned between the first lead and the third lead. The first memristor material may be positioned between the first lead and the second lead. The second memristor material may be positioned between the second lead and the third lead.
    Type: Application
    Filed: December 7, 2020
    Publication date: June 9, 2022
    Applicant: Rockwell Collins, Inc.
    Inventors: Kyle B. Snyder, Nathaniel P. Wyckoff, Brandon C. Hamilton, Bruce Rowenhorst, Steven J. Wiebers
  • Publication number: 20220181548
    Abstract: A system may include an array of interconnected memristors. Each memristor may include a first electrode, a second electrode, and a memristor material positioned between the first electrode and the second electrode. The system may further include a controller communicatively coupled to the array of interconnected memristors. The controller may be configured to tune the array of interconnected memristors.
    Type: Application
    Filed: December 7, 2020
    Publication date: June 9, 2022
    Applicant: Rockwell Collins, Inc.
    Inventors: Kyle B. Snyder, Nathaniel P. Wyckoff, Brandon C. Hamilton, Bruce Rowenhorst, Steven J. Wiebers
  • Publication number: 20220077390
    Abstract: A system may include a first conductive plate configured at least to receive an input signal and a second conductive plate configured at least to output an output signal. The system may further include a first memristor material positioned between the first conductive plate and the second conductive plate. The system may further include a second memristor material positioned between the first conductive plate and the second conductive plate. The first memristor material and the second memristor material may be in parallel electrically. The first memristor material may be different from the second memristor material.
    Type: Application
    Filed: September 10, 2020
    Publication date: March 10, 2022
    Inventors: Kyle B. Snyder, Nathaniel P. Wyckoff, Brandon C. Hamilton, Bruce Rowenhorst, Steven J. Wiebers
  • Publication number: 20220077388
    Abstract: A system may include a first conductive plate configured at least to receive an input signal. The system may include a second conductive plate configured at least to output an output signal. The system may further include a memristor material positioned between the first conductive plate and the second conductive plate.
    Type: Application
    Filed: September 10, 2020
    Publication date: March 10, 2022
    Inventors: Kyle B. Snyder, Nathaniel P. Wyckoff, Brandon C. Hamilton, Bruce Rowenhorst, Steven J. Wiebers
  • Patent number: 6591391
    Abstract: An 8-VSB modulated signal is produced using software to randomize, encode and interleave an MPEG II data signal and then converting the 2-bit encoded signals to 3-bit encoded signals using hardware.
    Type: Grant
    Filed: May 16, 2000
    Date of Patent: July 8, 2003
    Assignee: Sencore Inc.
    Inventors: Bruce Rowenhorst, Jeffrey Briden