Patents by Inventor Bruce Shen

Bruce Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240092885
    Abstract: The present disclosure provides gene therapy expression constructs comprising a nucleic acid encoding a therapeutic anti-TNFalpha antibody (e.g., a monoclonal antibody) or an antigen binding fragment thereof, delivery vectors (e.g., viral vectors) comprising the same, compositions comprising the same, and methods of using the same (e.g., to treat ocular diseases or disorders). Some aspects of the disclosure are directed to a recombinant adeno-viral vector (rAAV) delivery comprising an AAV particle (e.g., AAV2) and a nucleic acid encoding a therapeutic anti-TNFalpha antibody (e.g., a monoclonal antibody) or an antigen binding fragment thereof.
    Type: Application
    Filed: January 26, 2022
    Publication date: March 21, 2024
    Inventors: Brian FURMANSKI, Bruce SCHNEPP, Nachi GUPTA, Shankar RAMASWAMY, Weiran SHEN
  • Patent number: 6759729
    Abstract: According to one exemplary embodiment, an integrated circuit chip comprises an oxide region. The integrated circuit chip further comprises a poly resistor having a first terminal and second terminal, where the poly resistor is situated over the oxide region. According to this exemplary embodiment, the integrated circuit chip further comprises a metal resistor having a first terminal and a second terminal, where the metal resistor is situated over the poly resistor, and where the first terminal of the metal resistor is connected to the first terminal of the poly resistor. According to this exemplary embodiment, the integrated circuit chip may further comprise a first metal segment connected to the second terminal of the metal resistor and a second metal segment connected to the second terminal of the poly resistor. The integrated circuit chip may further comprise an inter-layer dielectric situated between the poly resistor and the metal resistor.
    Type: Grant
    Filed: October 16, 2002
    Date of Patent: July 6, 2004
    Assignee: Newport Fab, LLC
    Inventors: Marco Racanelli, Chun Hu, Bruce Shen