Abstract: A laminated piezoelectric composite comprises a metallic substrate (20); a piezoelectric wafer (32) having a first surface and a second surface; a first adhesive carrier layer (100) between the first surface of the piezoelectric wafer (32) and the substrate (22); a first conductive lead (110) carried by the first adhesive carrier layer (100) and connected to a first surface of the piezoelectric wafer (32); and, a second conductive lead (100?) connected to the second surface of the piezoelectric wafer (32). The first adhesive carrier layer (100) serves both to adhere the first surface of the piezoelectric wafer (32) to the substrate (22) and to carry a first conductive lead (110) for supplying an electrical signal or voltage to the first surface of the piezoelectric wafer (32). The second conductive lead (110?) supplies an electrical signal or voltage to the second surface of the piezoelectric wafer (32). The first adhesive carrier layer can comprise a high dielectric soluble aromatic polyimide film.