Abstract: A method of manufacturing an air pressure sensor is disclosed. A plurality of sensor circuitry modules are formed on a first side of a silicon wafer. A plurality of cavities on a second side of the silicon wafer are formed. Each of the plurality of cavities is aligned with one of the plurality of sensor circuitry modules. A glass wafer is attached to the second side of the silicon wafer. The silicon wafer and the glass wafer are cut such that a single sensor circuitry module is separated from the other sensor circuitry modules and a portion of the glass wafer remains attached to the sensor circuitry module so that the cavity opposite the sensor circuitry module is enclosed by the portion of the glass wafer to form a reference pressure chamber therebetween. The sensor circuitry module is flexibly mounted to an interior surface of a sensor housing. The sensor circuitry module is electrically connected to external conductive connectors.