Patents by Inventor Bruce W. Chignola

Bruce W. Chignola has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7489226
    Abstract: An embedded core electrical transformer (120) for DC to DC current conversion at a switching frequency of 1 MHz has reduced volume and weight with increased power density. The electrical transformer (120) utilizes a plurality of conductive elements (132) disposed inside a hollow cavity (128) used to embed two magnetic cores (134, 136). The conductive elements (132) encircle three sides of the embedded cores (134, 136) and interface with a multilayer PCB (137) which includes conductive traces formed therein to encircle a fourth side of the embedded cores and to form primary and secondary winding circuits.
    Type: Grant
    Filed: May 9, 2008
    Date of Patent: February 10, 2009
    Assignee: Raytheon Company
    Inventors: Bruce W. Chignola, Boris S. Jacobson, Donald H. Desrosiers, Dennis R. Kling
  • Patent number: 6888218
    Abstract: The invention provides systems and methods for interconnecting circuit devices, wherein decoupling capacitors are disposed on a substrate and an interconnect layer having a pattern of circuit connections is formed by a deposition process over the capacitors thereby embedding the decoupling capacitors within the interconnect layer. Circuit devices can be mounted to the surface of the deposited interconnect layer at locations that minimize, or substantially minimize, the interconnect length between the chip device and the decoupling capacitors for that circuit device.
    Type: Grant
    Filed: October 10, 2001
    Date of Patent: May 3, 2005
    Assignee: The Raytheon Company
    Inventors: Dennis R. Kling, Christopher D. Cotton, Bruce W. Chignola
  • Publication number: 20020048927
    Abstract: The invention provides systems and methods for interconnecting circuit devices, wherein decoupling capacitors are disposed on a substrate and an interconnect layer having a pattern of circuit connections is formed by a deposition process over the capacitors thereby embedding the decoupling capacitors within the interconnect layer. Circuit devices can be mounted to the surface of the deposited interconnect layer at locations that minimize, or substantially minimize, the interconnect length between the chip device and the decoupling capacitors for that circuit device.
    Type: Application
    Filed: October 10, 2001
    Publication date: April 25, 2002
    Applicant: The Raytheon Company
    Inventors: Dennis R. Kling, Christopher D. Cotton, Bruce W. Chignola