Abstract: A method of encapsulating microelectromechanical (MEMS) structures is provided wherein the MEMS structures are formed on a substrate and encapsulated prior to packaging thereof. A sacrificial material is first deposited over the substrate to cover at least a portion of the MEMS structure. An encapsulation material is then deposited over the sacrificial material such that the encapsulation material covers at least a portion of the sacrificial material over the MEMS structure. The sacrificial material is subsequently removed such that the encapsulation material forms a shell spaced apart from and covering the MEMS structure and permits the intended operation of the MEMS structure. Associated MEMS devices fabricated using a method of encapsulating MEMS structures according to embodiments of the present invention are also provided.

Abstract: Microelectronic interconnections are fabricated by forming a via in a first face of a microelectronic substrate that extends only partially through the microelectronic substrate towards a second face thereof. The via includes a sidewall and a floor. An insulating layer is formed on the sidewall. A plating electrode is formed on the second face. Metal is electroplated in the via from the floor by passing plating current between the plating electrode and the floor through the microelectronic substrate therebetween. The substrate then is thinned at the second face to expose the metal that was electroplated. Electroplated metal through-substrate interconnections thereby may be fabricated.

Abstract: An electrically and mechanically robust microelectromechanical transducer is formed of a pleated dielectric sheet having patterned electrical conductors on the opposing faces thereof. The pleats define a plurality of spaced apart walls, with each wall including an electrically conductive portion at one side thereof. Positive and negative voltages, applied to opposite faces of the pleated sheet, cause the walls to move towards one another by electrostatic attraction. The walls can also move away from one another by electrostatic repulsion upon application of appropriate voltages. The microelectromechanical transducer may be fabricated by fabricating a sheet with integral pleats or by forming a "self-pleating" flat sheet which forms pleats after conductor fabrication thereon.

Abstract: The present invention comprises methods for treating photoresists and forming photoresist relief images, including a method comprising providing a photoresist coating having a crosslinked surface layer, treating the photoresist coating with an organometallic material, and developing the photoresist coating to provide a relief image comprising an etch resistant effective amount of organometallic material.